With the acquisition of NANIUM, Amkor will have an equally compelling value proposition in the low-density fan-out area. NANIUM is widely viewed as the fan-out technology leader as well as a very capable manufacturer, having shipped more than one billion WLFO packages utilizing a state-of-the-art 300mm wafer-level packaging production line. The acquisition of NANIUM will strengthen Amkor’s position in the fast growing market of wafer-level packaging for smartphones, tablets & other applications. NANIUM is based near Porto, Portugal, with offices in Germany & USA.
By assembling, testing and shipping more than one million SiP devices per day, Amkor Technology has a proven track record as the industry leader in SiP design, assembly and test. Similar to a System on Chip (SoC) approach, Amkor's SiP technology is an ideal solution in markets that demand smaller size with increased functionality. However, SiP has the added benefit of compatibility with die design changes and integration of various die technologies (e.g., Si, GaAs, SiGe, SOI, MEMS) without the high cost and lead time associated with SoC development and manufacturing.
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|07/24/17||Amkor Technology to Announce Second Quarter 2017 Financial Results on July 31, 2017|
|06/19/17||Amkor Technology Announces Notice of Partial Redemption of 6.625% Senior Notes due 2021|
|06/15/17||Amkor Technology Recognized as Supplier of the Year for Second Consecutive Year by Qualcomm|
|06/01/17||Amkor Technology to Present at Upcoming Conferences|
|Amkor Article in CSR May/June Issue, "What is Driving Advanced Packaging Platforms Development?" Technical Article