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WLFO Packaging Solutions

Amkor is a world leader in Wafer-Level Fan-Out, the fastest-growing packaging technology, and one of the advanced packaging platforms that is the most promising. The interest sparked by WLFO stems from all the strong benefits it offers, which are particularly appealing to markets with small-form factor needs, tight transmission loss requirements or high performance demands. WLFO enables flexible System-in-Package (WLSiP) and heterogeneous integration (WL3D) packaging solutions.


SiP Packaging Solutions

By assembling, testing and shipping more than one million SiP devices per day, Amkor Technology has a proven track record as the industry leader in SiP design, assembly and test. Similar to a System on Chip (SoC) approach, Amkor's SiP technology is an ideal solution in markets that demand smaller size with increased functionality. However, SiP has the added benefit of compatibility with die design changes and integration of various die technologies (e.g., Si, GaAs, SiGe, SOI, MEMS) without the high cost and lead time associated with SoC development and manufacturing.

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Upcoming Events

01/22/18 European 3D Summit 2018
03/04/18 BiTS 2018
03/13/18 EDTM 2018
03/19/18 SEMI-THERM Symposium