Amkor is a world leader in Wafer-Level Fan-Out, the fastest-growing packaging technology, and one of the advanced packaging platforms that is the most promising. The interest sparked by WLFO stems from all the strong benefits it offers, which are particularly appealing to markets with small-form factor needs, tight transmission loss requirements or high performance demands. WLFO enables flexible System-in-Package (WLSiP) and heterogeneous integration (WL3D) packaging solutions.
By assembling, testing and shipping more than one million SiP devices per day, Amkor Technology has a proven track record as the industry leader in SiP design, assembly and test. Similar to a System on Chip (SoC) approach, Amkor's SiP technology is an ideal solution in markets that demand smaller size with increased functionality. However, SiP has the added benefit of compatibility with die design changes and integration of various die technologies (e.g., Si, GaAs, SiGe, SOI, MEMS) without the high cost and lead time associated with SoC development and manufacturing.
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|11/21/17||Amkor Technology to Present at Upcoming Conferences|
|10/30/17||Amkor Technology Reports Financial Results for the Third Quarter 2017|
|10/23/17||Amkor Technology to Announce Third Quarter 2017 Financial Results on October 30, 2017|
|09/26/17||Amkor Technology to Present at Deutsche Bank’s Leveraged Finance Conference|
|Amkor Article in CSR May/June Issue, "What is Driving Advanced Packaging Platforms Development?" Technical Article