Amkor Main Banner

 


Amkor Completes NANIUM Aquisition

With the acquisition of NANIUM, Amkor will have an equally compelling value proposition in the low-density fan-out area. NANIUM is widely viewed as the fan-out technology leader as well as a very capable manufacturer, having shipped more than one billion WLFO packages utilizing a state-of-the-art 300mm wafer-level packaging production line. The acquisition of NANIUM will strengthen Amkor’s position in the fast growing market of wafer-level packaging for smartphones, tablets & other applications. NANIUM is based near Porto, Portugal, with offices in Germany & USA.

 


SiP Packaging Solutions

By assembling, testing and shipping more than one million SiP devices per day, Amkor Technology has a proven track record as the industry leader in SiP design, assembly and test. Similar to a System on Chip (SoC) approach, Amkor's SiP technology is an ideal solution in markets that demand smaller size with increased functionality. However, SiP has the added benefit of compatibility with die design changes and integration of various die technologies (e.g., Si, GaAs, SiGe, SOI, MEMS) without the high cost and lead time associated with SoC development and manufacturing.

Stay Up to Date on Amkor Technology via Email and Social Media

Amkor Technology now offers multiple ways to stay updated about our products, services and technology offerings as well as upcoming industry conferences that we may be presenting and/or exhibiting at.

Stay connected to Amkor by subscribing to our email list or following us on our social media profiles Linkedin, Facebook, Twitter, Google+ and YouTube.

Data Sheets

 

Upcoming Events