With the acquisition of NANIUM, Amkor will have an equally compelling value proposition in the low-density fan-out area. NANIUM is widely viewed as the fan-out technology leader as well as a very capable manufacturer, having shipped more than one billion WLFO packages utilizing a state-of-the-art 300mm wafer-level packaging production line. The acquisition of NANIUM will strengthen Amkor’s position in the fast growing market of wafer-level packaging for smartphones, tablets & other applications. NANIUM is based near Porto, Portugal, with offices in Germany & USA.
By assembling, testing and shipping more than one million SiP devices per day, Amkor Technology has a proven track record as the industry leader in SiP design, assembly and test. Similar to a System on Chip (SoC) approach, Amkor's SiP technology is an ideal solution in markets that demand smaller size with increased functionality. However, SiP has the added benefit of compatibility with die design changes and integration of various die technologies (e.g., Si, GaAs, SiGe, SOI, MEMS) without the high cost and lead time associated with SoC development and manufacturing.
Stay Up to Date on Amkor Technology via Email and Social Media
Amkor Technology now offers multiple ways to stay updated about our products, services and technology offerings as well as upcoming industry conferences that we may be presenting and/or exhibiting at.
|09/26/17||Amkor Technology to Present at Deutsche Bank’s Leveraged Finance Conference|
|08/31/17||Amkor Technology to Present at Upcoming Conferences|
|08/02/17||Amkor Technology to Present at Oppenheimer’s 20th Annual Technology, Internet & Communications Conference|
|07/31/17||Amkor Technology Reports Financial Results for the Second Quarter 2017|
|10/19/17||SiP Conferences China 2017|
|10/24/17||China International Semiconductor Executive Summit 2017|
|Amkor Article in CSR May/June Issue, "What is Driving Advanced Packaging Platforms Development?" Technical Article