Amkor Technology invites you to join us at SiP Conferences China 2017, scheduled on October 19-20, 2017 at the Hilton Shenzhen Shekou Nanhai in Shenzhen, China.
The SiP Conferences China 2017 is the premier international event that brings the best in packaging, SiP manufacturing assembly and test, advanced SiP architectures and design mythologies, new materials solution to enhance SiP electrical, thermal and mechanical integrities.
Nozad Karim, VP - Product Line SiP at Amkor Technology, will be the Opening Keynote Speaker discussing “Current and Future Opportunities and Challenges for SiP Design, Assembly and Test.”
Amkor is a premier sponsor of this event and will be exhibiting with our technical staff on hand for any questions or discussions.
To register and for more information on this event, please visit their website at: http://www.cetimes.com/sip