Amkor Technology invites you to join us at IWLPC 2017, Oct 24-26, 2017 at the DoubleTree by Hilton in San Jose, CA.
Amkor is a proud sponsor of this conference and will be exhibiting at Booth #33 with our technical staff on hand to discuss packaging solutions and answer questions.
On Tuesday, October 24th, 8:00 – 8:30 AM, Gerard John, Sr Director - APD Test at Amkor, will present "Have you Designed for Manufacturing Test?" in the Cedar room.
Curtis Zwenger, VP, Adv. Package & Technology Integration at Amkor, is the IWLPC General Chair and will give the Welcome Comments at 10:45 AM on Tuesday in the Oak Ballroom.
On Wednesday, October 25th, 3:45 – 4:15 PM, Jonathan Micksch, Design Manager at Amkor, will present "Package Assembly Design Kits - The Technology Bridge between Chip Design and Wafer-Level Manufacturing and Assembly" in the Pine room.
On Thursday, October 26th, 1:30 – 5:00 PM, Fernando Roa Ph.D., Sr Director, fcCSP/fpfcCSP/PoP at Amkor, will teach a Professional Development Course "Package on Package, Design, Process and Quality" in the San Carlos room.
To register and for additonal information, please visit: http://www.iwlpc.com/