Amkor Technology invites you to join us at the IMAPS 50th Anniversary Symposium, scheduled on Oct 9-12, 2017 at the Raleigh Convention Center in Raleigh, NC.
Amkor will be exhibiting at Booth #106 with our technical staff on hand to discuss packaging solutions and answer questions.
Mon. Oct. 9th, 10:30 AM - 12:30 PM
"Introduction to Package-on-Package (PoP) Design, Assembly and Quality: Focus on New Trends and Applications for Advanced Packaging"
Fernando Roa, Amkor Technology, Inc.
Wed. Oct. 11th, 10:00 am - 10:25 am
"Direct Measurement of Silicon Strain in a Fine Pitch Flip Chip BGA Package"
Nathan Whitchurch, Amkor Technology, Inc. (Glenn Rinne, Wei Lin)
Thurs. Oct. 12th, 9:45 am - 10:10 am
"Implementation of Wafer Level Packaging KOZ using SU-8 as Dielectric for the Merging of WL Fan Out to Microfluidic and Bio-Medical Applications"
Andre Cardoso, NANIUM, SA (Raquel Pinto, Elisabete Fernandes, Steffen Kroehnert)
For additional information and to register, please visit: http://www.imaps.org/imaps2017/