Where: Nuremberg, Germany

When: 08-Oct-2017 - 13-Oct-2017

Details:

Amkor Technology invites you to join us at the 47th European Microwave Conference (EuMC) in Nuremberg, Germany on October 8-13, 2017.

Eoin O'Toole, WLFO Engineer at Amkor Technology, will present “Fan Out Wafer Level System in Package (WLSiP)” from 09:15-10:00 during the WS-10 Session: Fan-out Wafer Level and 3D Packaging Technologies for RF and mm-Wave Applications on Sunday, October 8th.

EuMC is the largest event in Europe dedicated to microwave components, systems and technology.

For additional information and to register, please visit: http://www.eumweek.com/



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