Amkor is one of the world’s largest providers of advanced semiconductor assembly and test services. Founded in 1968, Amkor has become a strategic manufacturing partner for many of the world’s leading semiconductor companies and electronics OEMs, providing our customers with a broad array of package design, assembly and test solutions. Amkor’s operational base encompasses more than 5 million square feet of manufacturing facilities, product development centers, and sales & support offices located in key electronics manufacturing regions in Asia, Europe and the United States.

China

Amkor's China factories are located in the Waigaoqiao Free Trade Zone in Pudong, Shanghai. Our factories produce a broad range of laminate and leadframe packages using chip scale, PBGA, stacked die, flip chip and MicroLeadFrame® formats. Our new C3 facility began operation in mid-2006 and will accommodate our long term manufacturing expansion in China. Click here for additional information on Amkor Technology China (ATC). Click here for the Amkor China Fact Sheet.

Facility	Square Footage	Operating Focus
C1	170,000	Wafer probe; Chip scale and 3D packages; Memory cards, Leadframe packages; and Test
C3	953,000	Flip chip; MicroLeadFrame®; and laminate packages

Japan

Amkor’s 120,000 square foot factory located in Kitakami, Iwate allows Amkor to better serve Japanese semiconductor companies with quick turn, high quality packaging and test services. Amkor Japan offers a wide array of laminate and leadframe packages, including PBGA, ChipArray, PLCC, SOIC, PDIP, TQFP, MQFP, Stacked packages, Wafer Level CSP (WLCSP), MicroLeadFrame®, Camera Module and VisionPak.

Facility	Square Footage	Operating Focus
J1	120,000	Wafer Probe; Packaging and Test Services; Test Development

Korea

South Korea is home to three Amkor factories with almost 2 million square feet of manufacturing space and a major R&D center. All locations are ISO-9002, QS-9000, ISO-14001, ISO-9001 and TS-16949 certified and offer high quality assembly and test services supporting a worldwide customer base. Some of the packages assembled here are PBGA, TEPBGA, SuperBGA®, EBGA, HPBGA, Tape-SBGA®.

Facility	Square Footage	Operating Focus
K1	670,000	Packaging Services; Package & Process Development
K3	432,000	Packaging and Test Services
K4	888,000	Wafer Bumping; Packaging and Test Services; Advanced R&D

Philippines

Amkor’s Philippines factories contain over 1.3 million square feet of manufacturing space and provide a full range of assembly and test services including ceramic, leadframe, laminate such as PBGA, SBGA, EBGA, HPBGA, and TEPBGA and System in Package (SiP), wafer probe, burn-in, strip test, tape & reel, test development and direct shipping. All locations are ISO-9002, QS-9000, ISO-14001, ISO 9001, TS16949 and DSCC / QML certified.

Facility	Square Footage	Operating Focus
P1	576,000	Packaging and Test Services; Process Development Services
P2	152,000	Packaging Services
P3	400,000	Packaging Services and Process Development Services
P4	225,000	Test Services and Test Development

Singapore

Following our 2004 acquisition of IBM's Singapore Test Operation, Amkor has built a critical mass of test engineering, production capacity and support services in this important semiconductor market. Our new S3 wafer bump facility, together with our existing S1 test center, will provide wafer bump and wafer probe services to support emerging applications on 300mm wafers at the 90 nm and 65 nm process nodes.

Facility	Square Footage	Operating Focus
S1	141,000	Wafer Probe; High-end Test; Test Development Services
S3	165,000	Electroplated Wafer Bumping

Taiwan

Amkor Taiwan provides an extensive offering of advanced package and test services for consumer applications, including turnkey Flip Chip solutions encompassing wafer bump, wafer probe, assembly and final test. Amkor also offers high-volume, 200mm and 300mm electroplated wafer bumping and wafer level packaging (WLCSP) services. Amkor's factories are located near Hsin Chu Science Park offering easy access to foundries and customers. All locations are ISO-9001, QS-9000 and ISO-14001 certified. Click here for the Amkor Taiwan Fact Sheet.

Facility	Square Footage	Operating Focus
T1	307,000	Packaging and Test Services
T3	314,000	Flip Chip Packaging, WLCSP and Test Services
T5	101,000	Electroplated Wafer Bumping on 200mm and 300mm; Polyimide Repassivation and Multi-Layer Redistribution; Wafer Level Chip Scale Packaging

United States

Amkor's Test facility in Arizona provides test development, test engineering and hardware development support for future network / communication products. Amkor also develops new test technologies to enable our RF / Wireless customers to succeed. Amkor North Carolina location is a state of the art web bumping, design and wafer level packaging technology development facility.

Click here for the Amkor RF Wafer & RF Test Development Service Sheet.