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Amkor is pleased to announce that on December 30, 2015, it completed its 100% ownership interest in J-Devices, Japan’s largest OSAT. This transaction cements Amkor’s position as the world’s second largest OSAT and makes it the largest OSAT for the automotive market. We see exciting opportunities to expand our business worldwide by capitalizing on our combined leadership expertise in IC packaging and test.


Flip Chip Packaging Solutions

Demand for flip chip interconnect technology is being driven by a number of factors from all corners of the silicon industry. To support this demand, Amkor is committed to being the leading provider of Flip Chip in Package (FCiP) technology. By partnering with proven industry leaders, Amkor has brought high volume packaging and assembly to the subcontract market. Flip Chip CSP, Flip Chip BGA and FlipStack CSP are qualified and are in production.

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Amkor Technology now offers multiple ways to stay updated about our products, services and technology offerings as well as upcoming industry conferences that we may be presenting and/or exhibiting at.

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