
Amkor’s FusionQuad® represents a breakthrough in leadframe-based plastic packaging through the effective integration of ExposedPad TQFP and MLF® technologies. The novel integration of bottom lands in a QFP provides a cost-effective platform for increased lead count in a small form factor. FusionQuad® not only extends the I/O range of classic leadframe packaging to nearly 400 unique pins, it also delivers an approximate 50% reduction in package size for a given leadcount. FusionQuad® provides excellent RF electrical performance characteristics.

Amkor Test Development group announces the release of the first automated multi-site wireless LAN system tester capable of testing WLAN 802.11 (a/b/g/n), WiMax 802.16, Zigbee, BT, and GPS. This tester integrates an off-the-shelf one-box-tester (OBT) for wireless standard conformance testing with power supplies, multimeter and PC control via SDIO interface. The M-WeST can dock to any standard ATE test handler for up to quad-site testing. Automated parallel testing reduces the cost of system-level testing and product time to market.
| 08/27/10 | Amkor Technology to Present at Rodman & Renshaw Annual Global Investment Conference |
| 08/27/10 | Amkor Technology to Present at Deutsche Bank Technology Conference |
| 08/04/10 | Amkor Technology Reports Second Quarter 2010 Financial Results |
| 07/22/10 | Amkor Technology to Present at Oppenheimer Technology, Media and Telecommunications Conference |
| 07/22/10 | Amkor Technology to Present at Citi Technology Conference |
| 07/21/10 | ITC Issues Notice of Final Determination Finding No Violation in Amkor MLF Patent Case against Carsem |
| 07/20/10 | Amkor Technology to Announce Second Quarter 2010 Financial Results on August 4, 2010 |
| 07/07/10 | Amkor Technology and Texas Instruments Deliver Industry's First Fine Pitch Copper Pillar Flip Chip Packages to Market |
| 06/22/10 | Amkor Technology, Inc. Announces Final Results of Tender Offer for a Portion of Its 9.25% Senior Notes Due 2016 |
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