Amkor’s bumping process is production certified through the full package size range from WLCSP, up through FCBGA. Amkor maintains strong initiatives in the area of technology development to further support customers’ future needs. Continuous improvement programs are in place to optimize and cost-reduce the wafer bumping processes. Our bumping operations are co-located with wafer probe; assembly and final test, enabling Amkor to provide complete "Turnkey" flip chip and WLCSP solutions in these key geographic locations.
Amkor offers Wafer Level CSP (WLCSP) to form solder bumps on device I/O pads or to add a copper redistribution layer and route from I/O pads to solder bumps on JEDEC / EIAJ standard pitches. WLCSP is a true chip-scale package, offering the smallest possible footprint. Amkor provides wafer bumping, wafer level test, back grind, dicing, and packing in tape & reel to support a full turn-key WLCSP solution. Amkor is able to integrate its wafer bumping products into high performance packaging options, such as fcCSP & SiP.
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