The Stacked CSP (SCSP) family leverages Amkor's industry leading ChipArray® manufacturing capabilities. This broad high volume infrastructure enables the rapid deployment of advances in die stacking technology across multiple products and factories to achieve lowest total cost requirements. These advanced assembly capabilities in combination with Amkor's expertise in design and test, enable stacks up to 16 active devices without sacrificing yield or mounted height requirements. Many customers have relied on Amkor to solve their highest density and most complex device stack combinations. Amkor has established industry leadership in stacking pure memory, mixed signal, and logic + memory devices.
A TSSOP / MSOP (Micro Small Outline Package) and VSSOP (Very-thin Shrink Small Outline Package) are leadframe based, plastic encapsulated packages that are well suited for applications requiring less than 1mm mounted height. These industry standard packages run in mid to high volume and provide a value added, low cost solution for a wide range of applications. A green BOM is standard, allowing devices to meet applicable Pb-free and RoHS standards. Amkor has a broad base of resources available to help our customers bring quality new products to market quickly and at low cost.
Test Solutions for MEMS & Sensors
Amkor has long been engaged in testing across multiple generations of a wide range of MEMS sensors. Amkor is experienced and well positioned to address today’s sensor test challenges and future devices. We offer a wide range of testers, handling equipment, product / test engineering support, test development and close partnerships with leading equipment makers. In 2011, Amkor tested over 200 million units of sensors.
|10/27/14||Amkor Technology Reports Financial Results for the Third Quarter 2014|
|10/21/14||Amkor Technology to Announce Third Quarter 2014 Financial Results on October 27, 2014|
|10/12/14||Amkor Technology Announces Rulings in Tessera Proceedings|
|09/22/14||Amkor Technology Receives Excellent Service Provider Award from SMIC|
|10/28/14||2014 Electronic System Technologies Conference (ESTC)|
|10/29/14||Intelligent Wearable Electronics Technology Development Summit and Application Expo 2014|
|11/05/14||4th Annual Global Interposer Technology Workshop (GIT 2014)|
|11/11/14||11th Annual International Wafer-Level Packaging Conference & Exhibition|
|11/12/14||Wearable Sensors & Electronics 2014|
|Amkor Article in CSR June Issue, "Enabling a Multiple Processor SiP with 2.5D TSVs" Technical Article
|"Core Power Delivery Network Analysis of Core and Coreless Substrates in a Multilayer Organic Buildup Package", White Paper
|Amkor article in China Integrated Circuit Magazine April 2014 Issue, "Trends and Considerations in Automotive Electronic Packaging" (Chinese)
|Amkor article in China Integrated Circuit Magazine March 2014 Issue, "Amkor Technology - Company Profile" (Chinese)
|Amkor article in China Integrated Circuit Magazine March 2014 Issue, "Trends for the Next Generation of PoP Package and Its Warpage Control" (Chinese)