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Amkor's New SLIM™ and SWIFT™ Packaging Technologies

Amkor is introducing two new, high-yielding integrated fan-out solutions called SLIM™ and SWIFT™.

To receive a pdf with detailed information on these award winning technologies, contact or your Amkor Sales Representative.


Flip Chip Packaging Solutions

Demand for flip chip interconnect technology is being driven by a number of factors from all corners of the silicon industry. To support this demand, Amkor is committed to being the leading provider of Flip Chip in Package (FCiP) technology. By partnering with proven industry leaders, Amkor has brought high volume packaging and assembly to the subcontract market. fcCSP, FCBGA and FlipStack CSP are qualified and are in production.

Stay Up to Date on Amkor Technology via Email and Social Media

Amkor Technology now offers multiple ways to stay updated about our products, services and technology offerings as well as upcoming industry conferences that we may be presenting and/or exhibiting at.

Stay connected to Amkor by subscribing to our email list or following us on our social media profiles Linkedin, Facebook, Twitter, Google+ and YouTube.

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