Ken Joyce Named President of Amkor Technology Amkor Reports First Quarter 2008 Results Amkor Technology Names Eric Larson Executive Vice President Product Management Group Amkor Technology to Announce First Quarter 2008 Financial Results on April 30, 2008 Amkor Technology Introduces FusionQuad(TM) Amkor to Present at Morgan Stanley Technology Conference Wafer Level Packaging Service Amkor's wafer level packaging service meets the industry's growing demand for full turnkey assembly and test solutions for CSP products. Amkor’s CSPnl™ has been widely adopted as the industry standard for cost effective, reliable, high performance wafer level CSP applications. It is available in three options: Direct Bump on Pad (BOP), Bump on Repassivation / Redistribution and Bump on Thick Repassivation / Redistribution. Click here for additional information. Stacked CSP Package The Stacked CSP (S-CSP) family utilizes Amkor's industry leading ChipArray® and TapeArray® manufacturing capabilities and proven package infrastructure while adding the enhancement of placing one die on top of another. Stacked CSP packages are designed for products requiring increased memory density and performance while reducing package size. Portable electronics products can benefit from the combination of stacked die, small footprint and up to 400+ ball count offered by Amkor's Stacked CSP. Click here for additional information. ExposedPad™ SOIC / SSOP Packages This Amkor- developed family of power IC packages significantly increases the thermal efficiency of power constrained standard SOIC and SSOP packages. The ExposedPad™ SOIC / SSOP can increase heat dissipation by as much as 110% over a standard SOIC / SSOP, thereby expanding the margin of operating parameters. Click here for additional information.