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Amkor's Headquarters is Moving!

Amkor Technology is happy to announce that we are moving to our new company headquarters in Tempe, Arizona. As of February 2nd, 2015 we will be open for business at our new location in the ASU Research Park. Our new address is:

Amkor Technology
2045 E. Innovation Circle
Tempe, AZ 85284

We are located just West of the 101 Freeway, on the North side of Warner Road in Tempe, Arizona.


MicroLeadFrame® Solutions

Amkor's MicroLeadFrame® (MLF/QFN) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses perimeter lands on the bottom of the package to provide electrical contact to the PWB. The package also offers Amkor's ExposedPad technology as a thermal enhancement by having the die attach paddle exposed on the bottom of the package surface to provide an efficient heat path when soldered directly to the PWB. We also offer a Flip Chip MLF® and Dual Row MLF® package.

Wafer Level Packaging Solutions (DSBGA | WLCSP | WLP)

Amkor offers Wafer Level CSP (WLCSP) to form solder bumps on device I/O pads or to add a copper redistribution layer and route from I/O pads to solder bumps on JEDEC / EIAJ standard pitches. WLCSP is a true chip-scale package, offering the smallest possible footprint. Amkor provides wafer bumping, wafer level test, back grind, dicing, and packing in tape & reel to support a full turn-key WLCSP solution. Amkor is able to integrate its wafer bumping products into high performance packaging options, such as fcCSP & SiP.

Data Sheets