SK hynix, Amkor Technology, eSilicon, Northwest Logic and Avery Design Systems have joined forces to offer a complete High-Bandwidth Memory (HBM) supply chain solution.
The HBM/2.5D white paper is available for download at the link below. Also included are links to videos of the HBM/2.5D Webinar and two Q&A Sessions that were conducted at the end of each of the webinars.
• HBM/2.5D Webinar
• 8 AM Webinar Q&A Session
• 6 PM Webinar Q&A Session
• HBM/2.5D White Paper
Please contact us to see how Amkor can help you with your HBM/2.5D design.
By assembling, testing and shipping more than one million SiP devices per day, Amkor Technology has a proven track record as the industry leader in SiP design, assembly and test. Similar to a System on Chip (SoC) approach, Amkor's SiP technology is an ideal solution in markets that demand smaller size with increased functionality. However, SiP has the added benefit of compatibility with die design changes and integration of various die technologies (e.g., Si, GaAs, SiGe, SOI, MEMS) without the high cost and lead time associated with SoC development and manufacturing.
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Amkor Technology now offers multiple ways to stay updated about our products, services and technology offerings as well as upcoming industry conferences that we may be presenting and/or exhibiting at.
|04/27/16||Amkor Technology Reports Financial Results for the First Quarter 2016|
|04/20/16||Amkor Technology to Announce First Quarter 2016 Financial Results on April 27, 2016|
|03/23/16||Amkor Technology Takes Leadership Position in Advanced System-in-Package Market|
|03/10/16||Amkor Technology Receives Intel’s Preferred Quality Supplier Award|
|Amkor Article in CSR March/April Issue, "The Internet of Things and MEMS Packaging" Technical Article