The StackedCSP family leverages Amkor's industry leading ChipArray® BGA manufacturing capabilities. This broad high volume infrastructure enables the rapid deployment of advances in die stacking technology across multiple products and factories to achieve lowest total cost requirements. These advanced assembly capabilities in combination with Amkor's expertise in design and test, enable stacks up to 16 active devices without sacrificing yield or mounted height requirements. Amkor has established industry leadership in stacking pure memory, mixed signal, & logic + memory devices.
A TSSOP / MSOP (Micro Small Outline Package) and VSSOP (Very-thin Shrink Small Outline Package) are leadframe based, plastic encapsulated packages that are well suited for applications requiring less than 1mm mounted height. These industry standard packages run in mid to high volume and provide a value added, low cost solution for a wide range of applications. A green BOM is standard, allowing devices to meet applicable Pb-free and RoHS standards. Amkor has a broad base of resources available to help our customers bring quality new products to market quickly and at low cost.
Wafer Bumping & Die Level Interconnect Solutions
Amkor’s bumping process is production certified through the full package size range from WLCSP, up through FCBGA. Amkor maintains strong initiatives in the area of technology development to further support customers’ future needs. Continuous improvement programs are in place to optimize and cost-reduce the wafer bumping processes. Our bumping operations are co-located with wafer probe; assembly and final test, enabling Amkor to provide complete "Turnkey" flip chip and WLCSP solutions in these key geographic locations.
|04/21/14||Amkor Technology to Announce First Quarter 2014 Financial Results on April 28, 2014|
|04/10/14||Amkor Technology Receives Intel’s Preferred Quality Supplier Award|
|03/13/14||Amkor Technology to Present at Goldman Sachs TMT Leveraged Finance Conference|
|02/10/14||Amkor Technology Reports Financial Results for the Fourth Quarter and Full Year 2013|
|05/22/14||12th Annual MEPTEC MEMS Technology Symposium|
|05/29/14||TSMC 2014 Taiwan Technology Symposium Ecosystem Pavilion|
|06/22/14||The ConFab 2014|
|09/10/14||GSA US Executive Forum|
|Amkor Article in the GSA Forum July Newsletter titled, "Embedded Die Packaging Technologies Enable Innovative 2D and 3D Structures for Portable Applications" Technical Article
|"Enhancing Overall System Functionality and Performance with the Right Packaging Solutions", White Paper