Amkor Technology is the world's leader in MEMS packaging technologies and the world’s largest outsource provider of MEMS and Sensors. Amkor offers a variety of modeling and characterization expertise to complement a proven high volume manufacturing (HVM) capability. This combination uniquely positions Amkor to assist customers quickly through the development phase and into HVM with new applications. Amkor currently has MEMS & Sensor manufacturing in our Korea, Taiwan and Philippines factories.
By assembling, testing and shipping more than one million SiP devices per day, Amkor Technology has a proven track record as the industry leader in SiP design, assembly and test. Similar to a System on Chip (SoC) approach, Amkor's SiP technology is an ideal solution in markets that demand smaller size with increased functionality. However, SiP has the added benefit of compatibility with die design changes and integration of various die technologies (e.g., Si, GaAs, SiGe, SOI, MEMS) without the high cost and lead time associated with SoC development and manufacturing.
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|12/14/16||Amkor Completes Product Qualification of SWIFT™ Packaging for Advanced Mobile, Networking and SiP Applications|
|11/03/16||Amkor Technology to Present at Upcoming Conferences|
|10/31/16||Amkor Technology Reports Financial Results for the Third Quarter 2016|
|10/19/16||Amkor Technology to Announce Third Quarter 2016 Financial Results on October 31, 2016|
|Amkor Article in CSR May/June Issue, "What is Driving Advanced Packaging Platforms Development?" Technical Article
|Amkor Article in CSR March/April Issue, "The Internet of Things and MEMS Packaging" Technical Article