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Amkor's 2015 Product Line Card


Flip Chip Packaging Solutions

Demand for flip chip interconnect technology is being driven by a number of factors from all corners of the silicon industry. To support this demand, Amkor is committed to being the leading provider of Flip Chip in Package (FCiP) technology. By partnering with proven industry leaders, Amkor has brought high volume packaging and assembly to the subcontract market. Flip Chip CSP, Flip Chip BGA and FlipStack CSP are qualified and are in production.

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