fcCSP (Flip Chip CSP)
Amkor Technology offers the fcCSP package -- a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or peripheral bump layout, replacing standard wire-bond interconnect. Current wafer bump technology and flip chip assembly process allows for peripheral flip chip bumping or area array bumping, with either solder or Copper Pillar (CuP) Bump Technology. The fcCSP is also available in LGA format, allowing for a lower minimum package thickness.
Wafer Bumping
Amkor’s bumping process is production certified through the full package size range from WLCSP, up through FCBGA. Amkor maintains strong initiatives in the area of technology development to further support customers’ future needs. Continuous improvement programs are in place to optimize and cost-reduce the wafer bumping processes. Our bumping operations are co-located with wafer probe; assembly and final test, enabling Amkor to provide complete "Turnkey" flip chip and WLCSP solutions in these key geographic locations.
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Flip Chip Interconnect Packaging Solutions
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Press Releases
| 05/20/13 | Amkor Technology Completes Sale of $225 Million of Its 6.375% Senior Notes Due 2022 |
| 05/16/13 | Amkor Technology to Present at Barclays 2013 High Yield Bond and Syndicated Loan Conference |
| 05/15/13 | Amkor Technology Announces Pricing of $225 Million of Its 6.375% Senior Notes due 2022 |
| 05/15/13 | Amkor Technology Announces Proposed Offering of Senior Notes |
Data Sheets
Upcoming Events
| 05/21/13 | Inaugural IPC Electronic System Technologies Conference (ESTC) |
| 05/28/13 | 63rd ECTC 2013 (IEEE Electronic Components and Technology Conference) |
| 06/05/13 | SEMICON Russia 2013 |
| 06/12/13 | MEPTEC June Luncheon |
| 09/10/13 | IPC Conference on Component Technology: Closing the Gap in the Chip to PCB Process |
