Amkor’s bumping process is production certified through the full package size range from WLCSP, up through FCBGA. Amkor maintains strong initiatives in the area of technology development to further support customers’ future needs. Continuous improvement programs are in place to optimize and cost-reduce the wafer bumping processes. Our bumping operations are co-located with wafer probe; assembly and final test, enabling Amkor to provide complete "Turnkey" flip chip and WLCSP solutions in these key geographic locations.
Amkor offers Wafer Level CSP (WLCSP) to form solder bumps on device I/O pads or to add a copper redistribution layer and route from I/O pads to solder bumps on JEDEC / EIAJ standard pitches. WLCSP is a true chip-scale package, offering the smallest possible footprint. Amkor provides wafer bumping, wafer level test, back grind, dicing, and packing in tape & reel to support a full turn-key WLCSP solution. Amkor is able to integrate its wafer bumping products into high performance packaging options, such as fcCSP & SiP.
Stay Up to Date on Amkor Technology via Email and Social Media
Amkor Technology now offers multiple ways to stay updated about our products, services and technology offerings as well as upcoming industry conferences that we may be presenting and/or exhibiting at.
|02/11/15||Amkor Technology Announces Senior Management Change|
|02/11/15||Amkor Technology Names Susan Kim to Board of Directors|
|02/09/15||Amkor Technology Reports Financial Results for the Fourth Quarter and Full Year 2014|
|02/03/15||Amkor Technology to Announce Fourth Quarter and Full Year 2014 Financial Results on February 9, 2015|
|03/17/15||11th International Conference and Exhibition on Device Packaging|
|03/17/15||SEMICON China 2015|
|05/17/15||International Microwave Symposium 2015|
|Amkor Article in CSR June Issue, "Enabling a Multiple Processor SiP with 2.5D TSVs" Technical Article
|"Core Power Delivery Network Analysis of Core and Coreless Substrates in a Multilayer Organic Buildup Package", White Paper
|Amkor article in China Integrated Circuit Magazine April 2014 Issue, "Trends and Considerations in Automotive Electronic Packaging" (Chinese)
|Amkor article in China Integrated Circuit Magazine March 2014 Issue, "Amkor Technology - Company Profile" (Chinese)