Flip Chip BGA (SuperFC® | FCBGA)
Amkor's SuperFC® (FCBGA / Flip Chip BGA) is THE high performance flip chip solution. Flip chip interconnect utilizes array interconnect of die to substrate as a replacement for conventional wire bonding. This allows the entire die surface to be used for electrical connections to the substrate, exponentially increasing the I/O per unit area vs. perimeter interconnect technologies. The package uses solder bump flip chip interconnect and can route over 1000 signal traces from a single die out to a 1.0 mm pitch BGA footprint.
PSfcCSP (Package Stackable fcCSP)
As handheld microprocessors have transitioned to advanced CMOS nodes with higher speed cores with higher I/O, there has been a transition from wirebond to flip chip die designs. Flip chip enables the use of an exposed die bottom package that integrates the package stacking design features of PSvfBGA in an fcCSP assembly flow, which Amkor calls PSfcCSP. Package Stacked Flip Chip CSP has a thin exposed Flip Chip die enabling fine pitch stacked interfaces at 0.5mm pitch which is a challenge in a center molded PSvfBGA structure.
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Flip Chip Interconnect Packaging SolutionsDemand for flip chip interconnect technology is being driven by a number of factors from all corners of the silicon industry. To support this demand, Amkor is committed to being the leading provider of Flip Chip in Package (FCiP) technology. By partnering with proven industry leaders, Amkor has brought high volume packaging and assembly to the subcontract market. SuperFC®, fcBGA, fcLBGA, FCmBGA and fcCSP are qualified and are in production. Wafer Bumping, WLCSP, and Flip Chip packaging solutions are qualified in lead-free options. |
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Press Releases
| 12/20/11 | Sales of Amkor Technology’s Next Generation Through Mold Via Package-on-Package Solutions Surpass 100 Million Units |
| 11/21/11 | Amkor Technology to Present at Credit Suisse Technology Conference |
| 11/14/11 | Toshiba and Amkor Jointly Agree to Postpone Discussions for Acquisition of Toshiba’s Malaysian Semiconductor Assembly and Test Operations Due to Thailand Flooding |
| 11/04/11 | Amkor Technology Announces Conversion of PBGA Products to Pin-Gate Mold Process |
Data Sheets
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