Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses perimeter lands on the bottom of the package to provide electrical contact to the PWB. The package also offers Amkor's ExposedPad technology as a thermal enhancement by having the die attach paddle exposed on the bottom of the package surface to provide an efficient heat path when soldered directly to the PWB. We also offer a Flip Chip MLF® and Dual Row MLF® package.
The Stacked CSP (SCSP) family leverages Amkor's industry leading ChipArray® Ball Grid Array (CABGA) manufacturing capabilities. This broad high volume infrastructure enables the rapid deployment of advances in die stacking technology across multiple products and factories to achieve lowest total cost requirements. These advanced assembly capabilities in combination with Amkor's expertise in design and test, enable stacks up to 16 active devices without sacrificing yield or mounted height requirements.
Die Processing & Inspection Services
Amkor's Die Processing operation offers a wide range of services for the WLCSP, flip chip and bare die industry. All processes are conducted in a Class 10K clean room environment using state-of-the-art equipment. Services include back grind, die prep, inspection, and pick and place into tape or trays. Die inspection capabilities include commercial and military Mil-Std-883 Condition B. Flip chip bump inspection is also available for gold and solder bumped product. In addition, special processing and shipping services are available upon request.
|08/21/14||Amkor Technology Names David Watson to Board of Directors|
|07/28/14||Amkor Technology Reports Financial Results for the Second Quarter 2014|
|07/21/14||Amkor Technology to Announce Second Quarter 2014 Financial Results on July 28, 2014|
|05/27/14||Amkor Technology and Carsem Jointly Announce Settlement|
|09/03/14||SEMICON Taiwan 2014 Advanced Packaging Technology Symposium|
|09/10/14||GSA US Executive Forum|
|10/07/14||SEMICON Europa 2014|
|10/13/14||IMAPS 2014 - San Diego|
|10/28/14||GSA Taiwan Semiconductor Leaders Forum|
|Amkor Article in CSR June Issue, "Enabling a Multiple Processor SiP with 2.5D TSVs" Technical Article
|"Core Power Delivery Network Analysis of Core and Coreless Substrates in a Multilayer Organic Buildup Package", White Paper
|Amkor article in China Integrated Circuit Magazine April 2014 Issue, "Trends and Considerations in Automotive Electronic Packaging" (Chinese)
|Amkor article in China Integrated Circuit Magazine March 2014 Issue, "Amkor Technology - Company Profile" (Chinese)
|Amkor article in China Integrated Circuit Magazine March 2014 Issue, "Trends for the Next Generation of PoP Package and Its Warpage Control" (Chinese)