Amkor Technology is happy to announce that we are moving to our new company headquarters in Tempe, Arizona. As of February 2nd, 2015 we will be open for business at our new location in the ASU Research Park. Our new address is:
2045 E. Innovation Circle
Tempe, AZ 85284
We are located just West of the 101 Freeway, on the North side of Warner Road in Tempe, Arizona.
Amkor's MicroLeadFrame® (MLF/QFN) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses perimeter lands on the bottom of the package to provide electrical contact to the PWB. The package also offers Amkor's ExposedPad technology as a thermal enhancement by having the die attach paddle exposed on the bottom of the package surface to provide an efficient heat path when soldered directly to the PWB. We also offer a Flip Chip MLF® and Dual Row MLF® package.
Wafer Level Packaging Solutions (DSBGA | WLCSP | WLP)
Amkor offers Wafer Level CSP (WLCSP) to form solder bumps on device I/O pads or to add a copper redistribution layer and route from I/O pads to solder bumps on JEDEC / EIAJ standard pitches. WLCSP is a true chip-scale package, offering the smallest possible footprint. Amkor provides wafer bumping, wafer level test, back grind, dicing, and packing in tape & reel to support a full turn-key WLCSP solution. Amkor is able to integrate its wafer bumping products into high performance packaging options, such as fcCSP & SiP.
|01/15/15||Amkor Technology Announces Comprehensive Settlement with Tessera|
|12/16/14||Amkor Technology Licenses Proprietary Copper Pillar Wafer Bump Technology to GLOBALFOUNDRIES|
|11/20/14||Amkor Technology to Present at Upcoming Conferences|
|10/27/14||Amkor Technology Reports Financial Results for the Third Quarter 2014|
|02/04/15||SEMICON Korea 2015|
|03/17/15||11th International Conference and Exhibition on Device Packaging|
|05/17/15||International Microwave Symposium 2015|
|Amkor Article in CSR June Issue, "Enabling a Multiple Processor SiP with 2.5D TSVs" Technical Article
|"Core Power Delivery Network Analysis of Core and Coreless Substrates in a Multilayer Organic Buildup Package", White Paper
|Amkor article in China Integrated Circuit Magazine April 2014 Issue, "Trends and Considerations in Automotive Electronic Packaging" (Chinese)
|Amkor article in China Integrated Circuit Magazine March 2014 Issue, "Amkor Technology - Company Profile" (Chinese)