Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses perimeter lands on the bottom of the package to provide electrical contact to the PWB. The package also offers Amkor's ExposedPad technology as a thermal enhancement by having the die attach paddle exposed on the bottom of the package surface to provide an efficient heat path when soldered directly to the PWB. We also offer a Flip Chip MLF® and Dual Row MLF® package.
Through Silicon Via (TSV) interconnects are emerging to serve a wide range of 3D packaging applications and 3D IC architectures that demand higher levels of performance and silicon integration. To enable the use of TSVs in these 3D applications, a number of back-end technology platforms are being developed and deployed for high volume processing. Amkor Technology is focused on developing technology solutions for the back end processing of Through Silicon Via based wafers.
Flip Chip Interconnect Packaging Solutions
Demand for flip chip interconnect technology is being driven by a number of factors from all corners of the silicon industry. To support this demand, Amkor is committed to being the leading provider of Flip Chip in Package (FCiP) technology. By partnering with proven industry leaders, Amkor has brought high volume packaging and assembly to the subcontract market. SuperFC®, fcBGA, fcLBGA, FCmBGA, fcCSP and FlipStack CSP are qualified and are in production. Wafer Bumping, WLCSP, and Flip Chip packaging solutions are qualified in lead-free options.
|10/22/14||3D-IC WG Meeting|
|10/23/14||3D Test Workshop at ITC/Test Week 2014|
|10/27/14||JEDEC’s Server Forum 2014|
|10/28/14||GSA Semiconductor Leaders Taiwan Forum|
|10/28/14||2014 Electronic System Technologies Conference (ESTC)|
|Amkor Article in CSR June Issue, "Enabling a Multiple Processor SiP with 2.5D TSVs" Technical Article
|"Core Power Delivery Network Analysis of Core and Coreless Substrates in a Multilayer Organic Buildup Package", White Paper
|Amkor article in China Integrated Circuit Magazine April 2014 Issue, "Trends and Considerations in Automotive Electronic Packaging" (Chinese)
|Amkor article in China Integrated Circuit Magazine March 2014 Issue, "Amkor Technology - Company Profile" (Chinese)
|Amkor article in China Integrated Circuit Magazine March 2014 Issue, "Trends for the Next Generation of PoP Package and Its Warpage Control" (Chinese)