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White Papers
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White Paper: "FusionQuad™: Novel Leadframe Based Package Provides Performance Boost for Hard Disk Drive Data Transfer Performance” By Tim Olson of Amkor Technology. Bill Rugg of Seagate Technology. Presented at the Pan Pacific Microelectronics Symposium; January, 2008 |
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White Paper: "Amkor & Solectron: Board Level Assembly and Rework Assessment of Thin Substrate Chip Scale Package (tsCSP), a Multi-Row Leadless Package” By Bob Bancod, Ahmer Syed, JaeYoon Kim, JongWoon Choi of Amkor Technology. Sundar Sethuraman, Allen Mays of Solectron. Presented at the 2007 IMAPS; November, 2007 |
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White Paper: "Amkor & Nokia Japan: 0.3mm Pitch CSP / BGA Development for Mobile Terminals” By Joan Scanlan, JongWook Park, and KwangSeok Oh of Amkor Technology. Takayoshi Katahira of Nokia Japan. Presented at the 2007 IMAPS; November, 2007 |
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White Paper: "Study on the Board Level Reliability Test of Package on Package (PoP) with 2nd Level Underfill” By Moody Dreiza, Amkor Technology. Presented at the 2007 ECTC; June, 2007 |
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White Paper: "High Density PoP (Package-on-Package) and Package Stacking Development” By Moody Dreiza & Akito Yoshida, Amkor Technology; Kazuo Ishibashi, Nokia; Tadashi Maeda, Panasonic. Presented at the 2007 ECTC; June, 2007 |
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White Paper: "Unveiling the Next Generation in Substrate Technology” By Ron Huemoeller, Amkor Technology, Inc. Presented at the 2006 Pacific Microelectronics Symposium; January, 2007 |
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White Paper: "Packaging a 40-Gbps Serial Link Using a Wire-Bonded Plastic Ball Grid Array", IEEE Design & Test of Computers 2006 |
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White Paper: "A Study on Package Stacking Process for Package-on-Package (PoP)", Presented at ECTC 2006 in San Diego, CA |
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White Paper: "Package on Package (PoP) | Stacking and Board Level Reliability, Results of Joint Industry Study", Presented at IMAPS 2006 March 23, 2006 |
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White Paper: "RF-SiP (System in Package) Design and Integration", Presented at The 2005 Asia-Pacific Microwave Conference (APMC 2005) December 4-7, 2005 |
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White Paper: "Stacked Die Package Design Guidelines", Presented at IMAPS 2004 November 17, 2004 |
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White Paper: "Enhancing the performance of wirebonded organic BGA packages through package codesign - Case study:12.5 Gbit/sec 16:1 Multiplexer with clock generator.", Presented at DesignCon 2004 June 30, 2004 |
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White Paper & Presentation: "Accumulated Creep Strain and Energy Density Based Thermal Fatigue Life Prediction Models for SnAgCu Solder Joints", Presented at 54th Electronic Components & Technology Conference June 3, 2004 |
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White Paper: "System in a Package Solution for DC-DC Converters", Presented at 2003 iMAPS Conference. |
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White Paper: “Board Level Assembly and Reliability Considerations for QFN Type Packages” By Ahmer Syed and WonJoon Kang, Amkor Technology Inc., Presented at 2003 SMTA conference. |
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White Paper: "System in Package: Flexibility Integration" Presented at 2003 SEMICO IMPACT Conference Series |
Application Notes
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Description |
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Application Notes for Preliminary Surface Mount for FusionQuad Package |
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Application Notes for Surface Mount Guidelines for Pb free Solder Assemblies |
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Application Notes for Surface Mount Requirements for Land Grid Array (LGA) Packages |
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Application Notes for Surface Mount Assembly of Amkor’s MicroLeadFrame (MLF) Packages |
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Application Notes for Surface Mount Assembly of Amkor's Thermally / Electrically Enhanced Leadframe Based Packages |
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Applications Notes on Surface Mount Requirements for Advanced Packaging Solutions |
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Application Specific Flip Chip Packages: Considerations and Options in Using FCIP |
Technical Articles
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Description |
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"Package-on-package (PoP) with Through-mold Vias” By Christopher Scanlan, Amkor Technology, Inc. This article originally appeared in Advanced Packaging Magazine, January 2008 |
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"Package-on-Package: The Story Behind This Industry Hit” By Lee Smith, Amkor Technology, Inc. This article originally appeared in Semiconductor International Magazine, June, 2007 |
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"Tin Pest in Tin-rich Solders” By Glenn A. Rinne, Unitive / Amkor Technology, Inc. This article originally appeared in Advanced Packaging Magazine, November, 2006 |
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"Stacked-Chip-Scale-Package-Design Guidelines” By Moody Dreiza, Amkor Technology, Inc. and Mark Gerber, Texas Instruments. This article originally appeared in EDN Magazine, June 8, 2006 |
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"Semiconductor Packaging Goes Vertical: Stacked Packaging Gets More Silicon in Less Space” This article originally appeared in Design News Magazine, June 5, 2006 |
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"How Flip-Chip Package Interactions Affect the Manufacture of High-Performance ICs” By Robert Lanzone, Amkor Technology, Inc. This article originally appeared in Chip Scale Review Magazine, February, 2006 |
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"Camera Module Assembly and Test Challenges” By Asif Chowdhury, Amkor Technology, Inc. This article originally appeared in Semiconductor International Magazine, February, 2006 |
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"How Advances in RF and Radio SiP Affect Test Strategies” By Mark Berry, Amkor Technology, Inc. This article originally appeared in Advanced Packaging Magazine, August, 2005 |
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"Package-on-Package (PoP) Space Savings with Flexibility” By Akito Yoshida, Amkor Technology, Inc. This article originally appeared in Advanced Packaging Magazine, August, 2005 |
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“Where the Silicon Hits the Board: Interview with Chris Scanlan, VP Package Development” This article originally appeared in EE Times UK Magazine, September 5, 2005 |
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“Stacked Package-on-Package Design Guidelines” By Moody Dreiza, Akito Yoshida, Jonathan Micksch and Lee Smith, Amkor Technology Inc. This article originally appeared in Chip Scale Review Magazine, July 2005 |
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“Using Co-Design to Meet Design Goals ” By Nozad Karim, Amkor Technology Inc. This article originally appeared in Cadence Online, March 2005 |
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“Microelectronics applications require the right stacked-memory-packaging architecture” By David Sempek., Amkor Technology Inc. This article originally appeared in EDN Magazine, February 2005 |
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"Economies of Scale: Amkor Test Services". This article originally appeared in Test & Measurement World Magazine, February 2005 |
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“Special Delivery: How Amkor's packaging proficiency helped Cisco's switches”. This article originally appeared in Electronics DesignChain Magazine, Fall 2004 |
All Application Notes, White Papers and Technical Articles are in Adobe Acrobat PDF format.
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