Demand for flip chip interconnect technology is being driven by a number of factors from all corners of the silicon industry. To support this demand, Amkor is committed to being the leading provider of Flip Chip in Package (FCiP) technology. By partnering with proven industry leaders, Amkor has brought high volume packaging and assembly to the subcontract market. fcCSP, FCBGA and FlipStack CSP are qualified and are in production.
Stay Up to Date on Amkor Technology via Email and Social Media
Amkor Technology now offers multiple ways to stay updated about our products, services and technology offerings as well as upcoming industry conferences that we may be presenting and/or exhibiting at.
|08/31/15||Amkor Technology to Present at Upcoming Conferences|
|07/27/15||Amkor Technology Reports Financial Results for the Second Quarter 2015|
|07/21/15||Amkor Technology to Announce Second Quarter 2015 Financial Results on July 27, 2015|
|07/21/15||Amkor Technology Announces Expansion of China Operations|