Demand for flip chip interconnect technology is being driven by a number of factors from all corners of the silicon industry. To support this demand, Amkor is committed to being the leading provider of Flip Chip in Package (FCiP) technology. By partnering with proven industry leaders, Amkor has brought high volume packaging and assembly to the subcontract market. Flip Chip CSP, Flip Chip BGA and FlipStack CSP are qualified and are in production.
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Amkor Technology now offers multiple ways to stay updated about our products, services and technology offerings as well as upcoming industry conferences that we may be presenting and/or exhibiting at.
|11/20/15||Amkor Technology to Present at Upcoming Conferences|
|10/26/15||Amkor Technology Reports Financial Results for the Third Quarter 2015|
|10/20/15||Amkor Technology to Announce Third Quarter 2015 Financial Results on October 26, 2015|
|09/23/15||Amkor Technology to Present at Deutsche Bank Leveraged Finance Conference|
|12/02/15||EPTC 2015 - 17th Electronics Packaging Technology Conference|
|01/10/16||2016 Industry Strategy Symposium (ISS)|
|01/18/16||European 3D TSV Summit 2016|
|01/27/16||SEMICON Korea 2016|
|Amkor Article in CSR October Issue, "Packaging ICs to Survive The Automotive Environment" Technical Article