Industry demands for higher levels of integration and lower costs coupled with a growing awareness of complete system configuration have continued to drive the popularity of System in Package solutions. Amkor's SiP technology is an ideal solution in markets that demand smaller size with increased functionality. With more than 1 billion SiP devices assembled and tested over more than 10 years, Amkor Technology has a proven track record as the industry leader in SiP assembly technology.
The Stacked CSP (SCSP) family leverages Amkor's industry leading ChipArray® BGA (CABGA) manufacturing capabilities. This broad high volume infrastructure enables the rapid deployment of advances in die stacking technology across multiple products and factories to achieve lowest total cost requirements. These advanced assembly capabilities in combination with Amkor's expertise in design and test, enable stacks up to 16 active devices without sacrificing yield or mounted height requirements.
Wafer Level Packaging Solutions (DSBGA | WLCSP | WLP)
Amkor offers Wafer Level CSP (WLCSP) to form solder bumps on device I/O pads or to add a copper redistribution layer and route from I/O pads to solder bumps on JEDEC / EIAJ standard pitches. WLCSP is a true chip-scale package, offering the smallest possible footprint. Amkor provides wafer bumping, wafer level test, back grind, dicing, and packing in tape & reel to support a full turn-key WLCSP solution. Amkor is able to integrate its wafer bumping products into high performance packaging options, such as fcCSP & SiP.
|12/16/14||Amkor Technology Licenses Proprietary Copper Pillar Wafer Bump Technology to GLOBALFOUNDRIES|
|11/20/14||Amkor Technology to Present at Upcoming Conferences|
|10/27/14||Amkor Technology Reports Financial Results for the Third Quarter 2014|
|10/21/14||Amkor Technology to Announce Third Quarter 2014 Financial Results on October 27, 2014|
|01/14/15||16th IC Packaging Technology Expo 2015|
|01/19/15||European 3D TSV Summit 2015|
|02/04/15||SEMICON Korea 2015|
|03/17/15||11th International Conference and Exhibition on Device Packaging|
|Amkor Article in CSR June Issue, "Enabling a Multiple Processor SiP with 2.5D TSVs" Technical Article
|"Core Power Delivery Network Analysis of Core and Coreless Substrates in a Multilayer Organic Buildup Package", White Paper
|Amkor article in China Integrated Circuit Magazine April 2014 Issue, "Trends and Considerations in Automotive Electronic Packaging" (Chinese)
|Amkor article in China Integrated Circuit Magazine March 2014 Issue, "Amkor Technology - Company Profile" (Chinese)
|Amkor article in China Integrated Circuit Magazine March 2014 Issue, "Trends for the Next Generation of PoP Package and Its Warpage Control" (Chinese)