Amkor’s ChipArray® Ball Grid Array (CABGA) packages are laminate based packages that are compatible with SMT mounting processes worldwide. The near chip size CABGA fine-pitch BGA (fBGA) offers a broad selection of ball array pitches (> 0.4mm pitch), ball counts and body sizes (1.5mm to 27mm body), single and multi-die layouts, stacked die (1-16) and passive component (up to 300) integration. Amkor offers high volume infrastructure on latest generation Cu wirebond equipment at all production locations.
Amkor’s Flip Chip Molded BGA (FCMBGA) package enables thinner packaging and improves thermal performance while reducing system cost. Presenting an exposed die format, this package uses a molding compound that replaces traditional capillary underfill to assemble larger die (< 20mm) onto BGA substrates (15mm - 42.5mm) without the structural need for a lid or stiffening ring. The technology was designed to address several considerations from improved reliability to reduced cost.
3D & Stacked Die Packaging Solutions
Since 1998, Amkor Technology has been a pioneer in developing and providing high volume, low cost 3D & stacked packaging technologies. Amkor understood the benefits that 3D packaging provided which would address a wide range of device combinations and end product applications. Amkor continues the commitment to solve tomorrow's multimedia and system integration challenges by employing innovative and cost effective 3D and System in Package (SiP) technologies.
|12/10/13||Amkor Technology Appoints Dr. Choon Heung Lee as Chief Technology Officer|
|11/20/13||Amkor Technology to Present at Credit Suisse Technology Conference|
|10/28/13||Amkor Technology Reports Financial Results for the Third Quarter 2013|
|10/21/13||Amkor Technology to Announce Third Quarter Financial Results on October 28, 2013|
|Amkor Article in the Fall MEPTEC Report titled, "Trends and Considerations in Automotive Electronic Packaging"