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Start Your HBM/2.5D Design Today: High-Bandwidth Memory Webinar Videos & White Paper

SK hynix, Amkor Technology, eSilicon, Northwest Logic and Avery Design Systems have joined forces to offer a complete High-Bandwidth Memory (HBM) supply chain solution.

The HBM/2.5D white paper is available for download at the link below. Also included are links to videos of the HBM/2.5D Webinar and two Q&A Sessions that were conducted at the end of each of the webinars.

    • HBM/2.5D Webinar
    • 8 AM Webinar Q&A Session
    • 6 PM Webinar Q&A Session
    • HBM/2.5D White Paper

Please contact us to see how Amkor can help you with your HBM/2.5D design.


SiP Packaging Solutions

By assembling, testing and shipping more than one million SiP devices per day, Amkor Technology has a proven track record as the industry leader in SiP design, assembly and test. Similar to a System on Chip (SoC) approach, Amkor's SiP technology is an ideal solution in markets that demand smaller size with increased functionality. However, SiP has the added benefit of compatibility with die design changes and integration of various die technologies (e.g., Si, GaAs, SiGe, SOI, MEMS) without the high cost and lead time associated with SoC development and manufacturing.

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