CHANDLER, Ariz. – March 15, 2012 - Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, today announced that Mike Liang has joined the company as President of Amkor Technology Taiwan.  Liang and his team are responsible for servicing our packaging and test customers and executing our strategies in Taiwan.  

“Mike Liang is a seasoned manufacturing executive with a proven track record in operations, sales and marketing for semiconductor packaging, wafer processing and testing services” said JooHo Kim, Amkor’s executive vice president, worldwide manufacturing operations.  “Mike’s extensive industry experience and proven leadership skills are a great fit for our manufacturing team.”

Liang joins Amkor Technology Taiwan from King Yuan Electronics Corporation in Hsin-Chu, Taiwan, where he most recently served as president and chief executive officer.  Prior to King Yuan Electronics Corporation, Liang held various executive and operational roles at Phoenix Semiconductor International, AbelLink Technology, Mosel-Vitelix, Ti-Acer, and United Microelectronics Corporation.  Liang holds a Bachelor of Science in physics from National Cheng Kung University and an MBA from National Taiwan University.

About Amkor

Amkor is a leading provider of semiconductor packaging and test services to semiconductor companies and electronics OEMs. More information on Amkor is available from the company’s Securities and Exchange Commission (the “SEC”) filings and on Amkor’s website:      


Amkor Technology, Inc.
Greg Johnson
Sr. Director, Corporate Communications