TSON8-FL (Flat Lead) is a smaller power discrete package (3.3 x 3.3 mm) with thermally enhanced that gives a 64% reduction in ootprint area compared with standard SOIC 8 ld package, et an equivalent maximum permissible power dissipation capability.

TSON8FL Power DiscreteThis package may also be know as:

  • TSON-Adv
  • PowerFLAT™ 3.3 x 3.3
  • miniHVSON
  • PowerPAK® 1212-8
  • JEDEC: MO240 BA



TSON8-FL is suitable for medium-power applications, esigned for low on-resistance and high-speed-switching MOSFETs:Battery protection circuits

  • Battery protection circuits
  • Notebook PCs
  • Portable electronic devices
  • DC-DC converters



  • Small and thermally enhanced package with the same ower dissipation but 64% less footprint area than SOIC 8 ld
  • Dual Cu Clip interconnect for better heat dissipationefficiency
  • Al strap + wire option is also available
  • Turnkey with test and packing services
  • Green materials: Pb-free plating & halogen free mold compound


New Developments

  • Dual exposed pad for better thermal performance
  • Thin wafer dicing with narrow saw streets
  • Larger/higher density leadframe strips
  • Environmentally friendly Pb-free solder paste


Process Highlights

  • Bare copper leadframe with no plating
  • Die attach: 55 um thin die pick up capability
  • Interconnect: Cu clips technology for better electrical and thermal performance. Also available on Al strap + wire option.
  • Plating: 100% matte Sn
  • Marking: Pen type laser


Standard Materials

  • Leadframe: Bare copper
  • Die attach: Solder paste* (*Apply to option dual Cu clips.)
  • Interconnect: 2 option,
  • Dual Cu clips
  • Multiple Cu wires
  • Mold compound: Halogen free


Reliability Qualification

Amkor devices are assembled with proven reliable semiconductor materials.

  • All test include pre-condition of: Ta = 85°C/Rh = 85%, 72 hrs with IR reflow Ta = 265°C, 2X
  • High Temperature Storage, Ta = 150°C, 1000 hrs
  • Pressure Cooker, Ta = 121°C/Rh = 100%/P = 2 atm, 96 hrs
  • Temperature Cycle, -65~150°C, 300 cycles


Test Service

Amkor offers full turnkey business for all power discrete products. We have the capability to test various type of power devices including MOSFETs, ipolar transistors, IGBTs, diodes, regulator ICs/intelligent power devices, etc.

  • Amkor power discrete test capability:
    • Static test (DC)
    • Dynamic test (AC, Switching/Trr, Capacitance/Rg)
    • Destruction test (Inductive load/VSUS, I Latch, Surge, Isolation/VIL)
    • Thermal Resistance (ΔVDS, ΔmV, etc.)
  • Program generation/conversion
  • Failure analysis
  • Available test/handling technology
  • Integrated marking, vision inspection and tape & reel services



  • Tape and reel packing
  • 3000 pcs or 5000 pcs per reel
  • Tape width 12 mm
  • Reel Φ = 330 mm
  • Barcode packing label
  • Drop ship


 TSON8 Cross Section


 TSON8 Outline Drawing

 For more information on the TSON8-FL discrete package, please contact an Amkor Regional Sales Office near you or fill out the Request Form.