CHANDLER, Ariz. -- Jan. 7, 2003--Recognizing the rapidly growing market for digital storage and I/O cards used in portable and hand-held applications, Amkor Technology, Inc. (Nasdaq: AMKR) has developed the industry's first, low cost, leadframe-based memory and I/O cards. Using its System in Package operations, Amkor provides a full set of turn-key services, including substrate layout and design, assembly, mold, mechanical lid assembly, test, device programming, labeling, drop shipment and supply chain management. Amkor is conducting prototype builds and production qualification on behalf of several customers.

Designed to reduce the cost of memory and I/O cards by as much as 50%, Amkor uses proprietary processes to create both lidded and fully molded cards in MultiMedia and SecureDigital card (MMC/SDC) formats using a leadframe packaging solution, which is far less costly than laminate package technology.

Industry analyst IDC estimates the market for memory cards to grow from 100 million in 2002 to more than 450 million in 2005. These cards support both memory and I/O applications. Memory cards include both Flash and Read-only memory and are used for storing data for use in PDAs, cell phones and other handheld devices. Applications using I/O cards include WLAN, Bluetooth, global positioning systems, digital cameras and electronic games.

Amkor established its memory card manufacturing capability in early 2000 and developed the industry's first fully automated production line for laminate-based MMC/SDC products. Since then Amkor has produced more than one million multimedia cards for a variety of customers.

Prior to development of Amkor's leadframe based technology, only the higher cost laminate technology was used. Amkor's low-cost solution capitalizes on Amkor's world-class leadframe packaging infrastructure together with an existing automated process used to implant the multimedia die assembly into the card housing. To further reduce customer risk and cost, Amkor uses its well-established leadframe guidelines to create non-lidded leadframe based memory cards in a fully molded configuration.

Amkor's lidded leadframe memory cards use an established automated process, which deposits adhesive material on the card housing (lid) and then attaches it to the die assembly with placement accuracy of 0.5 mil. Amkor's fully molded leadframe memory cards use the MMC/SDC compliant form, without the use of a separate lid assembly. In either case, the leadframe of the die assembly incorporates the seven/nine-pin connector that corresponds with the connector in the end-use application. The net result is an MMCA/SDCA compliant leadframe-based memory card. The over-molded die assembly, for either the lidded or fully molded LF-MMC/SDC, typically includes multiple components, including memory, passives and a micro-controller.

MMCs are assembled to a standard 24 mm x 32 mm x 1.4 mm form factor, while SDCs are produced on a 24 mm x 32 mm x 2.1 mm form factor. Memory capacity depends on the design of the silicon die inserted into the memory card, but typically hold 16 or 32 megabytes of information -- music, text, photographs or other data. By stacking multiple memory chips into the memory card, Amkor is able to increase the memory capacity to 128 MB without increasing the dimensions of the card.

"These innovations make Amkor the clear packaging leader for memory cards, shattering competitor cost targets," said Mike Steidl, Amkor's senior vice president of advanced packaging development. "All customers need to do is send their wafers and specifications and Amkor will do the rest."

About Amkor:

Amkor Technology, Inc. is the world's largest provider of contract semiconductor assembly and test services. The company offers semiconductor companies and electronics OEMs a complete set of microelectronic design and manufacturing services. More information on Amkor is available from the company's SEC filings and on Amkor's web site:

     Amkor Technology, Inc., Chandler
Jeffrey Luth, 480/821-2408 ext. 5130
VP Corporate Communications