As the demand for outsourcing continues to grow and supply chains continue to shorten, Amkor is committed to increase our role in the customers' value chain. To this end, Amkor offers a full line of value-added semiconductor services.
By becoming involved in the customers' projects as early as possible, Amkor feels they can add benefits such as Electrical Package Characterization and Thermal Package Characterization. Using these two Amkor specialized semiconductor services, customers can better understand how their device will react both electrically and thermally once it inside a finished package. Knowing this at the beginning of the design phase helps designers make better decisions for a superior performing end product.
Getting involved at the die design phase also allows Amkor's Packaging Design Center to create the optimum package for any device. Our IC design experts can advise on how specific aspects of the device will interact with a given package design to help optimize the device performance.
Adding to this, Amkor has the expertise and experience to provide wafer probe or test solutions for the entire spectrum of integrated circuits through our many Test Services facilities. Located worldwide for customer convenience, Amkor offers IC test services for any device, from simple digital logic, complex ASIC, high speed digital, memory, mixed signal and RF / Wireless devices.
These semicodnuctor services along with several others such as Die Processing & Inspection, Package Signal Integrity Analysis, Failure Analysis, Qualification Testing, Engineering Support and an Online Customer Center combine to make Amkor a valuable link in the customers supply chain.