Amkor's Plastic Dual In-line Package (PDIP) has a proven track record and is a common choice for assembly of logic, memory, microcontrollers, and other devices for use in a wide range of applications. The straight leads with 100 mil pitch allows for easy board mounting (through-hole wave soldering) or socket insertion.

PDIP Services and Support:

Amkor has a broad base of resources available to help our customers bring quality new products to market quickly and at lowest cost.

  • PDIP

    Full package characterization
  • Thermal, mechanical stress, and electrical performance modeling
  • Turnkey assembly, test and drop ship
  • World class reliability testing and failure analysis

PDIP Features:

  • Standard JEDEC package outlines
  • Multi-die production capability
  • Turnkey test services, including strip test options
  • Green materials are standard - Pb free and RoHS compliant

PDIP Reliability Qualification:

Amkor package qualification uses three independent production lots and a minimum of 77 units per test group.

Temp cycle:   -65 / +150°C, 500 cycles
uHAST:   130°C / 85% RH, No Bias, 96 hrs
High temp storage:   150°C, 1000 hours


Process Highlights:

  • PCC wire bonding standard, Ag wire available
  • Wafer backgrinding services available
  • Multiple die and die stacking capability
  • Matte Sn lead finish is standard
  • Laser Mark on package body

Test Services:

  • Program generation / conversion
  • Wafer probe
  • Burn-in
  • -55 °C to +165 °C test available
  • Strip test available


Shipping Options:

  • Clear anti-static tube, 20 inch
  • Drop ship

PDIP Cross Section:

PDIP cross section


For more information on the PDIP, DIP, CDIP (Ceramic DIP) package, please contact an Amkor Regional Sales Office near you or fill out the Request Form.


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