Amkor Technology, Inc. and NANIUM S.A. announced on February 2, 2017 that they have entered into a definitive agreement for Amkor to acquire NANIUM, a world class provider of wafer-level fan-out (WLFO) semiconductor packaging solutions. The acquisition of NANIUM will strengthen Amkor’s position in the fast growing market of wafer-level packaging for smartphones, tablets and other applications. NANIUM is based near Porto, Portugal, and has offices in Dresden, Germany and Boston, USA.
By assembling, testing and shipping more than one million SiP devices per day, Amkor Technology has a proven track record as the industry leader in SiP design, assembly and test. Similar to a System on Chip (SoC) approach, Amkor's SiP technology is an ideal solution in markets that demand smaller size with increased functionality. However, SiP has the added benefit of compatibility with die design changes and integration of various die technologies (e.g., Si, GaAs, SiGe, SOI, MEMS) without the high cost and lead time associated with SoC development and manufacturing.
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|02/13/17||Amkor Technology Reports Financial Results for the Fourth Quarter and Full Year 2016|
|02/06/17||Amkor Technology to Announce Fourth Quarter and Full Year 2016 Financial Results on February 13, 2017|
|02/02/17||Amkor Technology to Acquire NANIUM|
|12/14/16||Amkor Completes Product Qualification of SWIFT™ Packaging for Advanced Mobile, Networking and SiP Applications|
|04/04/17||GSA European Executive Forum|
|05/17/17||IMAPS Minapad Forum 2017|
|05/24/17||MEMS World Summit 2017|
|06/06/17||MEPTEC’s 15th Annual MEMS and Sensors Technology Symposium|
|09/10/17||IMAPS EPMC 2017|
|Amkor Article in CSR May/June Issue, "What is Driving Advanced Packaging Platforms Development?" Technical Article