Amkor Technology invites you to join us at the IMAPS SiP 2017 on June 27-29 at the Doubletree Sonoma Wine Country in Sonoma, California. SiP 2017 is the first System-in-Package (SiP) conference fully dedicated to covering all aspects related to SiPs - market trends, system integration/miniaturization, and new technology innovation enablers to meet current and future SiP challenges. This conference will bring the entire SiP supply and design chain from OEM, Fabless, IDM, OSAT, EMS, EDA, silicon foundries, equipment and material suppliers together under one roof.
Nozad Karim, VP, Electrical Engineering at Amkor Technology is the General Chair and will be presenting the opening keynote presentation: "Past, Present and Future of SiP" from 8:00 AM - 8:45 AM on Tuesday, June 27th.
Amkor is the premier sponsor of this event and will be exhibiting with our technical staff on hand for any questions or discussions.
To register and for more information on this event, please visit their website at: http://www.imaps.org/sip/index.htm