Amkor Technology and J-Devices invites you to join us at SEMICON Taiwan 2017, scheduled on September 13-15, 2017 at the Taipei Nangang Exhibition Center in Taipei, Taiwan.
SEMICON Taiwan is the premier event in Taiwan for microelectronics manufacturing. Connect with the companies, people, products and information shaping the future of design and manufacturing for semiconductors, nanoelectronics, MEMS, Photovoltaics and related advanced electronics.
Steve D. Kelley, President and CEO of Amkor Technology, will be a Grand Opening Keynote Speaker from 09:20 - 09:30 during the Executive Summit: Transformation - A Key to Solutions session.
Dr. Mike Ma, President of Amkor Technology Taiwan will be the Forum Chairman during the Advanced Packaging Technology Symposium’s: Package Innovation in Automotive session.
Min Yoo, VP - Amkor Technology Taiwan, will be the Moderator and present the Opening Remarks from 09:20 - 09:30 during the Advanced Packaging Technology Symposium’s: Package Innovation in Automotive session.
Akio Katsumata, PLP Development Engineer at J-Devices, will present “J-Devices' Semiconductor Package Technology for Automotive” from 11:45 - 12:10 during the Advanced Packaging Technology Symposium’s: Package Innovation in Automotive.
Curtis Zwenger, VP – R&D, at Amkor Technology, will present “Fan-out Packaging and advancements in Wafer Level” from 14:05 - 14:35 during the 3D Technology Forum: 3D IC, 3D interconnection for AI & High-End Computing.
For additional information and to register, please visit: http://www.semicontaiwan.org