Where: Messe Dresden, Germany

When: 09-Oct-2012 - 10-Oct-2012


Packaging Solutions for the New Technologies

Date: 9-10 October, 2012
Time: 13:00-17:30 / 09:00-13:00
Location: Garden Hall, Messe Dresden

Tuesday, 9 October
Session 4: Packages
11:35    "Case Study of an Advanced Two-Sided Copper Pillar Package" Presented by Moody Dreiza, Amkor Technology

For further information, please visit SEMICON Europa 2012 website.

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