Where: Pudong, Shanghai China

When: 19-Mar-2013 - 21-Mar-2013



Nowadays, electronic products are becoming shorter, smaller, thinner, and lighter. To meet these requirements, we need to scale down the wafer size according to Moore’s Law. However, as the scale of the chip size shrinks, Moore’s Law has reached its limit. What shall we do beyond Moore’s Law? SEMI China will hold a forum to discuss the solution of 3D Integration and analyze the market trend of this technology.


Nozad Karim of Amkor Technology will be presenting, "Electrical, Thermal and Mechanical Characterizations of a 2.5D/3D System" from 9:40am - 10:10am in the Ballroom 2&3 at the Kerry Hotel.


TSV (Through Silicon Via) and silicon interposers are amongst the most promising technologies that offer the greatest vertical interconnects density.   The 2.5D/3D technology introduced a new degree of design complexities which are not familiar to many designer and EDA tools. 2.5D/3D provides increased levels of integration but it also  creates more stringent design bottlenecks in the areas of thermal management, mechanical constrains,  signal integrity, power delivery, and power integrity. A practical approach to electrical, thermal, and mechanical modeling and validation of 2.5D/3D needs to be developed with consideration of micro level (TSV and interposer structure) and macro level system level simulations.  Modeling of TSV is challenging due to its dependency on the material properties of medium surrounding it.  This dependency impacts thermal and mechanical property which by itself impacts the signal losses/attenuation, capacitance effects, and the coupling among the vertical interconnects. On the Macro level, new electrical characteristics of the system must be closely coupled with the thermal and mechanical tolerance of the entire 2.5D/3D packaging structure. Traditional separate electrical, thermal and mechanical analyses are no longer sufficient due to the close proximity of the power and signal distribution network. A new design paradigm shift is greatly needed to toggle 2.5D/3D system performance optimization.


Nozad Karim presently is the Vice President of Electrical Engineering and Characterization at Amkor Technology Inc. He has over 30 years experience working with semiconductor packaging, System in Package, circuit and system designs for digital, analog, and RF/Microwave applications. He is been with Amkor since 1997. Prior to Amkor, he served in engineering and management roles with the following fortune 100 companies in the United States of America: Motorola Communication, Texas Instruments, & Compaq Computer

For additional information, please visit thier website: http://www.semiconchina.org

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