Where: Tokyo Big Sight

When: 18-Jan-2017 - 18-Jan-2017


Amkor Technology invite you to join us at the 18th PWB Expo Wednesday, January 18th through Friday, January 20th at the Tokyo Big Sight in Japan.

WonChul Do, Sr. Director - R&D Div. Group, will present “High Density Fan Out Wafer Level Packaging” on Wednesday, January 18th at 9:30AM. This presentation discusses the limitations of conventional fan-out wafer level packaging and introduces emerging high density fan-out technologies developed for use in high I/O count, multi-chip, and 3D/SiP applications. Package structure and attributes, key assembly technologies, and requirements for material and equipment are presented.

For additional information on the upcoming expo, visit: http://www.nepconjapan.jp/en/About/PWB_EXPO

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