Amkor Technology invites you to join us at MNE2017 in Braga, Portugal on September 18-22, 2017.
André Cardoso, R&D Integrator at Amkor Technology, will present “Packaging R&D at Amkor/NANIUM: Stretching Fan-Out Wafer Level Packaging to New Limits and Markets” at 17:30 during Session 2G on Thursday, September 21st.
MNE2017 is a major annual conference devoted to micro- and nano-engineering and manufacturing, held in a European country every September. The Conference brings together engineers and scientists from across the world to discuss recent progress and future trends in research, fabrication, and applications of micro and nano devices.
For additional information and to register, please visit: http://mne2017.org