Where: San Francisco, CA

When: 29-Aug-2017 - 01-Sep-2017


Amkor Technology invites you to join us at the InterPACK 2017 conference, scheduled on Aug 29 - Sept 1, 2017 at the Hilton San Francisco Financial District in San Francisco, CA.

InterPACK is the premier international forum for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronic packaging, MEMS, and NEMS.

Rama Alapat, VP - Strategic Development at Amkor, will be a panelist during the "3D Packaging – Key Drivers, Opportunities and Challenges" session being held on September 1st.

For additional information and to register, please visit: https://www.asme.org/events/interpack


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