Amkor Technology invites you to join us at the IMAPS Minapad Forum 2017 on May 17-18. The IMAPS Minapad Forum is the major electronics packaging, interconnection and integration conferences of France. The objective of this event is to reinforce the design community (which constitutes the largest share of the semiconductor community in Europe) and the assembly and packaging community.
Amkor will be presenting and exhibiting at this event.
For additional information on this conference and to register, please visit IMAPS Minapad Forum 2017.