Where: San Diego, CA USA

When: 13-Oct-2014 - 16-Oct-2014


The 47th Symposium on Microelectronics will cover three tiers of electronics: Systems and Applications; Design and related measurements; and Materials, Process and Reliability. IMAPS 2014 will feature 6 technical tracks that span three days: INTERPOSERS & 3D PACKAGING; THE FUTURE OF PACKAGING; ADVANCED PACKAGING, INTERCONNECTS & ASSEMBLY; MATERIALS & PROCESSES; MODELING, DESIGN, & TEST; and SPECIAL SESSIONS ON 3D & Embedding and Reliability. The 2014 Symposium will also feature an Interactive Industry/Student Poster Session, the Panel Discussion Thursday morning on The Future of Packaging, as well as 6 keynotes from Qualcomm, IBM, IPDiA, Jawbone, and Micron, and much more!.


Fernando Roa, Director - Director - fcCSP / fpfcCSP / PoP at Amkor, will present the following: "Fine pitch Copper Pillar interconnection with C4 (Mass Reflow) Processing"


Fine bump pitch and wide area array flip chip interconnection design and process capability has been extended with the use of copper pillar. In terms of processing, devices using Cu Pillar have overwhelmingly been assembled using thermo-compression techniques that hold the die in place while a temp ramp causes the joint to form. This process most often also requires the use of a non-conductive paste/film for stress absorption. In this paper, we extend that envelope by showing examples of devices where we have extended Cu pillar flip chip using regular mass reflow plus regular capillary or molded underfilling. The benefits of this approach are the decreased cost of ownership for materials and while leveraging equipment that’s mostly already depreciated; finally the use of existing process flows enables easy to use, design rules that are well understood and accepted with materials whose properties are well known. Multiple packaging applications are presented where alternate processing schemes have been successfully deployed to leverage current process capabilities while making use of the flexibility in substrate design and real estate expansion enabled by the use of CuP. Comparison in terms of cost, bill of materials and opportunities for further application are discussed and presented.

For additional information on this event, please visit their website: http://www.imaps.org/imaps2014

If you are planning on attending this event we would welcome the opportunity to meet with you and discuss how we may be able to assist you with your future product development and services needs. Please email us at marketing@amkor.com.



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