Where: Lake Buena Vista, Florida

When: 30-May-2017 - 02-Jun-2017


Amkor Technology invites you to ECTC 2017 in Lake Buena Vista, Florida on May 30th - June 2nd located at the Walt Disney World Swan and Dolphin Resort.  

The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the Components, Packaging and Manufacturing Technology (CPMT) Society of the IEEE.

Amkor will be exhibiting with our technical staff on hand for any questions or discussions.

Amkor Presentations:

Thurs. June 1st – 4:45 PM

"SACQ Solder Reliability Evaluation and Life Prediction Model for Wafer Level ", Wei Lin, Quan Pham, Michael Johnson, Bora Baloglu – Amkor Technology

Fri. June 2nd – 10:00 AM

"3D Packaging Challenges for High- End Applications ", co-authored with GLOBALFOUNDRIES - Rahul Agarwal, Sukesh Kannan. Rick Reed, Yong Song, WangGu Lee, SangHyoun Lee, JinKun Yoo, Luke England – Amkor Technology

Interactive Presentations: May 31, 9:00 a.m. - 11:00 a.m. and 2:00 p.m. - 4:00 p.m.

Thurs. June 1st - 9:00 AM – 11:00 AM

"High-Reliability Challenges with Cu Wire Bonding for Automotive Devices in the AEC-Q006", JunHo Jeon, SungHo Jeon, SeokHo Na, TaeKyeong Hwang, Kwangmo Lim, and JuHoon Yoon - Amkor Technology

Thurs. June 1st - 9:00 AM – 11:00 AM

"Electrical and Thermal Simulation of SWIFT™ High Density Fan-out PoP Technology", Curtis Zwenger, Bora Baloglu, George Scott, Mike Kelly, WonChul Do, JiHun Yi, WonGeol Lee - Amkor Technology


Thurs. June 1st - 2:00 PM - 4:00 PM

"On the Process/History-Dependence of Package Mechanical Performance ", Mingji Wang, Lou Nicholls, MiNa Mo, MinJae Lee, Quan Pham, and Yong Song - Amkor Technology

For additional information and to register, please visit: http://www.ectc.net/

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