Where: Lake Buena Vista, FL

When: 27-May-2014 - 30-May-2014


Amkor Technology invites you to join us at the 64th ECTC 2014 (IEEE Electronic Components and Technology Conference) being held May 27-30 in Lake Buena Vista, Florida. This premier international packaging, components, and microelectronic systems technology conference offers attendees an outstanding array of packaging technology information.

Amkor’s technical staff will be presenting six papers at this year’s conference, in addition to co-authoring three papers, participating in an evening plenary panel session and co-chairing on several committees.

Amkor will also be participating in the Exhibit Pavilion with our technical staff on hand for questions or discussions – please visit us at booth #200.

Presentations at this year’s event include:

Wed. May 28th

Session 2: Advances in Copper Pillar & Solder Based Flip Chip Technologies

10:50 am – "Development of Fine Pitch Area Array Cu Pillar/Lead Free Solder Bumps for Large 28 nm Die in Large Organic Flip Chip Packages"

John Osenbach, Suzanne Emerich, David Crouthamel, and Steven Cate – LSI Corporation; Danny Brady and Seung Min Hwang – Amkor Technology, Inc.

Session 37: Interactive Presentations 1

9:00 am - 11:00 am – "Very Thin Packaging Approaches to Achieve Functionality Integration Prior to TSV Implementation"

Fernando Roa – Amkor Technology, Inc.

Session 38: Interactive Presentations 2

2:00 pm - 4:00 pm – "Optimization of CMP Process for Second TSV Reveal of Backside Process Considering Interaction Effect of Related Processes and Die Design"

Donghoon Lee, D. H. Kim, S. C. Han, J. S. Park, H. H. Jung, J. H. Kim, Y. S. Chung, S. M. Seo, and Choon Lee – Amkor Technology Korea; Y. S. Kim – Sungkyunkwan University

2014 ECTC Plenary Session

7:00pm - 9:00 pm – Packaging Influence on System Integration and Performance

Nozad Karim – "Integration Embraces Packaging", Amkor Technology, Inc.


Thurs. May 29th

Session 13: 3D Process Integration & Die Stacking

8:50 am – "Optimization and Challenges on TSV MEOL Integration"

D. H. Kim, D. H. Lee, Y. C. Seo, J. S. Park, S. C. Han, B. R. Jang, J. H. Khim, Y. S. Chung, S. M. Seo, and C. Lee – Amkor Technology Korea

10:00 am – "TSV Integration on 20nm Logic Si: 3D Assembly and Reliability Results"

Rahul Agarwal, Sebastian Dej, Sukeshwar Kannan, Sara Thangaraju, Jens Paul, and Dan Smith – GLOBALFOUNDRIES; Dave Hiner, Kiwook Lee, Dohyeong Kim, Jongsik Paek, and Sunggeun Kang – Amkor Technology, Inc.

Session 39: Interactive Presentations 3

9:00 a.m. - 11:00 am – "The Study of Bare Die FCBGA Die Damage in Response to Applied Mechanical Stress during Heat Sink Assembly"

Heidi S. Y. Ho and Daijiao Wang – Broadcom Corporation; Michael Johnson and C. J. Berry – Amkor Technology, Inc.


Fri. May 30th

Session 28: System-Level Thermal & Mechanical Models II

8:25 am – "Cu Pillar Flip Chip Assembly: Chip Attach Process Failure Mode Study"
Shengmin Wen – Amkor Technology, Inc.

Session 31: PoP, SiP and Die Stacking

1:55 pm – "Strip Grinding Introduction for Thin PoP and CSP"

Jinseong Kim – Amkor Technology Korea

Session 32: Substrates

1:55 pm – "Coreless Substrate with Unsymmetric Dielectric Layer Design to Improve Package Warpage"

Wei Lin, Bora Baloglu, Ken Stratton, Shengmin Wen, and Sai Priya Sundarraman – Amkor Technology, Inc.

Further information about the event can be found at http://www.ectc.net/


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