Where: Disneyland Hotel - Anaheim, California, USA

When: 12-Sep-2013 - 13-Sep-2013


Session 8: Panel Discussion
11:20AM How Will 3D Testing Change the Test Supply Chain?
Moderator: Bill Bottoms Third Millennium Test Solutions, USA


Adam Cron
Principal Engineer
Synopsys, USA

Gary Fleeman
VP of Marketing
Advantest, USA

Gerard John
Technical Director Test Development
Amkor, USA

TM Mak
Director 2.5D/3D DfT Strategy
GlobalFoundries, USA

Erik Jan Marinissen
Principal Scientist

Daniel Rishavy
Principal Product Manager
TEL Test Systems, USA

Overview of the workshop:

The 3D-TEST Workshop focuses exclusively on test of and design-for-test for three-dimensional stacked ICs (3D-SICs), including Systems-in-Package (SiP), Package-on-Package (PoP), and especially 3D-SICs based on Through-Silicon Vias (TSVs), micro-bumps, and/or interposers. While 3D-SICs offer many attractive advantages with respect to heterogeneous integration, smaller form-factor, higher bandwidth and performance, and lower power dissipation, there are many open issues with respect to testing such products. The 3D-TEST Workshop offers a forum to present and discuss these challenges and (emerging) solutions among researchers and practitioners alike.

3D-TEST will take place in conjunction with the IEEE International Test Conference (ITC) and is sponsored by the Test Technology Technical Council (TTTC) of IEEE Computer Society. For additional information on the workshop, visit: http://3dtest.tttc-events.org/



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