3D ASIP is recognized as the premier conference on 2.5 / 3DIC focused on commercialization and infrastructure. Continuing the tradition of offering cutting-edge presentations from scientists, technologists and business leaders from across the globe.
Amkor Technology is a Silver Sponser at this years conference. Amkor will also presenting the following:
Mike Kelly, Sr Director, Adv Package & Technology Integration, will be presenting "Next Generation Multi-Die IC Packaging – 2.5D, 3D and Beyond" from 3:40pm-4:00pm.
For additional information and to register, visit: http://3dasip.org/