Where: San Francisco, CA

When: 13-Dec-2016 - 15-Dec-2016


3D ASIP is recognized as the premier conference on 2.5 / 3DIC focused on commercialization and infrastructure. Continuing the tradition of offering cutting-edge presentations from scientists, technologists and business leaders from across the globe.

Amkor Technology is a Silver Sponser at this years conference. Amkor will also presenting the following:

Mike Kelly, Sr Director, Adv Package & Technology Integration, will be presenting "Next Generation Multi-Die IC Packaging – 2.5D, 3D and Beyond" from 3:40pm-4:00pm.

For additional information and to register, visit:  http://3dasip.org/

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