Where: Chukyo University Nagoya Campus

When: 29-Aug-2017 - 30-Aug-2017


Amkor Technology and J-Devices invites you to join us at the 27th Microelectronics Symposium (MES 2017), scheduled on August 29-30, 2017 at the Chukyo University Nagoya Campus in Nagoya, Japan.

Keiji Nosaka, Package Designer at J-Devices/Amkor, will be presenting "Study on Stress Simulation Method For Cu Wire Junction of BGA Package" during Session 2: Reliability, Evaluation and Analysis Technology on Tuesday, August 29th.

For additional information and to register, please visit: https://web.jiep.or.jp/event/mes.html


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