Where: SMX Convention Center

When: 21-Jun-2017 - 23-Jun-2017

Details:

Amkor Technology invite you to visit and attend the activities of the 14th Philippine Semiconductor and Electronics Convention and Exhibition (PSECE), scheduled on June 21-23, 2017 at the SMX Convention Center in Manila, Philippines.

Amkor will be presenting the following:

"Particle Reduction Program Using Automatic Blow and Vacuum Cleaning System For CLCC MEMS Uncapped Devices" will be presented on June 22nd in Room 4 & 5 from 4:30-5:00pm.

"ASIC Pad Crack Defect Elimination Thruogh Wirebond Parameter Optimization Focusing on ASIC Bonds of Stacked CSP Devices" will be presented on June 23rd in Room 7, 8 & 9 from 2:30-3:00pm.

"Combination of Process Fault Diagnosis Analysis and Six Sigma Tool Technique: An Approach to Address Assembly Reject Escapes" will be presented on June 22nd in Room 10 from 2:00-2:30pm.

"Wirebond Quality Issues Reduction Through Lot Control and Cerification System" will be presented on June 22nd in Room 10 from 2:30-3:00pm.

"Automated DA Cure Processing Using SMART Console" will be presented on June 23rd in Room 1 from 3:30-4:00pm.

"The Power of Data Analytics in Semiconductor Manufacturing" will be presented on June 22nd in Room 7, 8 & 9 from 4:00-4:30pm.

"The Smarter Factory: A New Framework Towards SMART Manufacturing Integration in the Semiconductor Industry" will be presented on June 23rd in Room 1 from 4:30-5:00pm.

"COPS: A High Degree Parallelism Test Solution For Leadless Packages" will be presented on June 22nd in Room 6 from 3:30-4:00pm.

For additional information and to register, please visit: http://www.seipi.org.ph/events/psece/

 

 



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