Where: Tokyo Big Sight

When: 18-Jan-2017 - 20-Jan-2017


Amkor Technology and J-Devices invite you to join us at the 18th IC Packaging Technology Expo and Automotive World 2017, Wednesday, January 18th through Friday, January 20th, 10:00 AM to 18:00 PM at the Tokyo Big Sight in Japan.

Visit our exhibit at Booth E31-4 for details on our extensive portfolio of advanced packaging technologies. Both Amkor and J-Devices have the experience and expertise necessary to meet the stringent demands of the automotive market as well as a broad range of semiconductor companies.

Jun Taniguchi, Sr. Manager - Japan Product Management at Amkor Technology Japan, will present “Semiconductor Package Demand and Latest Technology Development Status For IoT Market” on Wednesday, January 18th. This presentation will detail the latest development status for SiP and MEMS Packaging as well as WLFO package integration for the expanding IoT market.

Fumihiko Taniguchi, Senior Manager, Packaging Research & Development Center, will present "J-Devices' Semiconductor Package Technology for Automotive" on Thursday, January 19th. This presentation will explain the latest package, technology and service offerings from J-Devices for the automotive sector.

If you are planning on attending this event, we welcome the opportunity to meet with you and discuss your future product development and service needs.

For additional information on the upcoming expos, visit: http://www.icp-expo.jp/en/Home/ and http://www.nepcon.jp/en/

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