Where: Fountain Hills, Arizona USA

When: 06-Mar-2017 - 09-Mar-2017


Amkor Technology invites you to join us at IMAPS DPC in Fountain Hills, Arizona at the WekoPa Resort and Casino on March 6-9, 2017.

IMAPS DPC is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields.

Amkor's Ron Huemoeller, Corporate Vice President, Worldwide R&D, will be a keynote speaker at this event.

Keynote Presentation: Heterogeneous Integration - Packaging the Future

Technology innovation in the semiconductor industry continues to march forward at an incredible pace, with advancements in new silicon node technology continuing on one end of the spectrum with innovation in packaging solutions coming forward at the other in a complementary fashion. As the pace of innovation has quickened, so has the investments required to bring such technologies to production.  At the packaging level, the investments required to support the advancements in silicon miniaturization and heterogeneous integration have now reached well beyond $500M USD per year.  One needs to look no further than the complexity of the most advanced package technologies being used today and coming into production over the next year to understand why.

Advanced packaging technologies have increased in complexity over the years, transitioning from single to multi-die packaging, enabled by 3-dimensional integration, system-in-package (SiP), wafer-level packaging (WLP) and creative approaches to embedding die. These new innovative packaging technologies enable more functionality and offer higher levels of integration within the same package footprint, or even more so, in an intensely reduced footprint.  Today, the latest in advancements in heterogeneous integrated semiconductor packaging is able to provide reduced form-factor, increased data transfer rate, improved signal integrity and memory bandwidth, all with reduced power and improved thermal performance.  As we truly live in a connected world and the proliferation of connected devices is forcing continually higher system level performance, not surprisingly, it is semiconductor packaging that has stepped up to play a pivotal role in providing the solutions to the new system level requirements.

Amkor will be presenting the following papers on Tuesday, March 7th:

Fan-Out, Wafer Level Packaging & Flip Chip - Tuesday afternoon

Silicon Wafer Integrated Fan-out Technology

Curtis Zwenger, Amkor Technology (George Scott, Ron Huemoeller, Amkor Technology, Inc.; WonChul Do, WonGeol Lee, JiHun Yi, Amkor Technology, Korea)

Interposers, 3D IC & Packaging - Tuesday afternoon

System Level Packaging - Module Integration, Current and Future

Mike Kelly, Amkor Technology (Curtis Zwenger, Jesse Galloway, Rama Alapati, Ron Huemoeller)

Amkor is pleased to be a sponsor at this event and will be exhibiting at Booth #38 with our technical staff on hand for any questions or discussions.

For additional information and to register, please visit: http://www.imaps.org/devicepackaging/


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