Amkor Technology Taiwan provides an extensive offering of advanced package and test services for consumer applications, including turnkey Flip Chip solutions encompassing wafer bump, wafer probe, assembly and final test. Amkor also offers high-volume, 200mm and 300mm electroplated wafer bumping and wafer level packaging (WLCSP) services. Amkor's factories are located near Hsin Chu Science Park offering easy access to foundries and customers.
In addition, our Taiwan manufacturing location is certified to TS-16949, ISO-9001, ISO-9002, OHSAS-18001, ISO-14001, and SONY Green Partner certified industry standards to provide you with consistently reliable, robust and high quality products.
AMKOR TECHNOLOGY TAIWAN, INC. (ATT) - T1
1F, No. 1, Kao-Ping Sec
Lungtan Township, Taoyuan County 325
Tel: 886.3.411.6000 | Fax: 886.3.471.6420
AMKOR TECHNOLOGY TAIWAN, INC. (ATT) - T3
11 Guangfu Road,
Hsinchu Industrial Park
Hukou County, Hsinchu 303
Tel: 886.3.5982000 | Fax: 886.3.5983985
AMKOR ADVANCED TECHNOLOGY TAIWAN, INC. (AATT) - T5
No. 39 Guang-fu North Rd.
Hsin-chu Industrial Park
Hu-kou Township, Hsin-chu County 303
Tel: 886.3.597.2777 | Fax: 886.3.597.2891
AMKOR TECHNOLOGY TAIWAN, INC. (Sales Office)
3F-1, No.1, Tai Yuen 2nd St., Zhubei City,