Speeding Time to Market: Turnkey IC Design, Assembly, Test and Logistics Solutions

Amkor Technology, Inc. is one of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world's leading semiconductor companies, foundries and electronics OEMs. Amkor's operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S.



Our Taiwan facility is a world-class solder bumping line with HVM production capability for 200 mm and 300 mm wafers. High lead, eutectic, and lead-free solder compositions (all low alpha) are production certified. In addition, the facility offers repassivation, single and multi-layer redistribution processes for both flip chip and wafer level chipscale package applications. Our Korea and Taiwan bumping operations are co-located with wafer probe, assembly and final test, enabling Amkor to provide complete "Turnkey" flip chip and WLCSP solutions in these key geographic locations. Amkor’s bumping process is production certified through the full package size range from WLCSP, up through SuperFC®.

Our wafer probe testing services provide for the visual inspection and electrical testing of the wafer for defects prior to packaging. Wafer probe includes wafer mapping, a method to identify the location and characteristics of each die on the wafer. We offer thermal controlled probe, bumped wafer probe, single and double pass probe and multi-site probe among others. 


Creating successful interconnect solutions for advanced semiconductor devices often poses unique thermal electrical and other design challenges, and Amkor employs a large number of package design engineers to solve these challenges. Amkor produces hundreds of package types which encompass more than 2,000 unique products, representing one of the broadest package offerings in the semiconductor industry. These package solutions are driven by the needs of our customers for more electrical connections, enhanced electrical or thermal performance, smaller package size and lower cost.

  • Turnkey solutions for wirebond and flip chip
  • High-volume manufacturing in 6 Asian countries
  • Broad portfolio of Pb-free and Green packages
  • Amkor assembles around 8% of the world’s ICs


Final test is the process of testing each device after it has been packaged. Final test analyzes the attributes of each device and determines if it meets criteria specified by the customer. We offer test services for many devices including simple digital logic, complex application specific integrated circuits, high speed digital, memory, mixed signal and RF and wireless devices.


  • Tape & reel
  • Dry pack
  • Warehousing
  • Drop ship to distribution centers in key electronics markets


Our research efforts focus on developing new package solutions, test services and improving the efficiency and capabilities of our existing production processes. We believe that technology development is one of the key success differentiators in the semiconductor packaging and test markets. By concentrating our research and development on our customers’ needs for innovative packages, increased performance and lower cost, we gain opportunities to enter markets early, capture market share and promote our new package offerings as industry standards. In addition, we leverage our research and development by licensing our leading edge technology, such as MicroLeadFrame, Copper Wirebond, Fine Pitch Copper Pillar, Through Mold Via, Lead Free Bumping and FusionQuad.
Our key areas for research and development are:

  • 3D Packaging
  • Advanced flip chip packaging
  • Advanced micro-electromechanical system packaging;
  • Copper Pillar bumping and packaging;
  • Copper wire interconnects;
  • Engineering and characterization tools;
  • Laminate and leadframe packaging;
  • Manufacturing cost reduction;
  • Through Mold Via (TMV) technology;
  • Through Silicon Via (TSV) technology;
  • Wafer level processing.


Amkor creates cost effective assembly and test solutions that enable our customers to shorten their time to revenue. We offer a broad portfolio of advanced packaging and test technology and state-of-the-art design resources, together with the industry’s most extensive operational scale.

 Location Map


Since pioneering the outsourcing of IC assembly and test more than four decades ago, Amkor has developed or commercialized virtually every major advance in semiconductor packaging. With more than 300 technologists committed to research and development, we have a strong focus on developing advanced packaging and test solutions:

  •  Amkor Design Center
  •  Wafer Level Packaging (WLP - CSPnl)
  •  System in Package (SiP)
  •  Green, Leadfree and Pb-Free Packaging
  •  Package on Package (PoP)
  •  Wafer Probe
  •  Multi-Chip (MCP) & Stacked Die Leadframe
  •  Strip Test
  •  Test Development
  •  Flip Chip Packaging
  •  Wafer Bumping



As integrated circuits become faster and more complex, the “interconnect” between semiconductor and system board is the battlefield where cost and performance become critical. Over the past four decades, Amkor’s industry-leading package design, assembly and test capabilities have enabled the application of Moore’s law to progress from semiconductor design to end product reality.



Smaller... lighter... faster... cheaper. Consumers are demanding greater functionality and performance in a smaller space at a lower cost. The future is about increasing the penetration of semiconductors through greater integration. Whether through evolution or revolution, Amkor is at the forefront of this process by taking a leading role investing in technologies and processes that enable higher levels of silicon integration.
For more information on our Products, Services and Technology Solutions, please contact an Amkor Regional Sales Office near you or fill out the Request for Information Form

About Us