WLFOWLFO's benefits include the flexibility to enable 3D multi-component package designs (WL3D); its outstanding performance at mechanical, electrical and thermal level; and its smaller, thinner and lighter package, as WLFO allows for the highest integration density commercially available in the industry.

Amkor is a world leader in Wafer-Level Fan-Out, the fastest-growing packaging technology, and one of the advanced packaging platforms that is the most promising. The interest sparked by WLFO stems from all the strong benefits it offers, which are particularly appealing to markets with small-form factor needs, tight transmission loss requirements or high performance demands.

WLFO enables flexible System-in-Package (WLSiP) and heterogeneous integration (WL3D) packaging solutions. Its superior electrical and thermal performance is due to shorter and more precise interconnections, as well as reduced material layers, which are specially recommended for very high frequency applications.

With our proven high-volume manufacturing capability, we have shipped over 700 million WLFO packages, achieving industry-level yields and full JEDEC quality/reliability compliance. WLFO is a RoHS- and REACH-compliant packaging technology.

For more information on our WLFO offerings, please contact an Amkor Regional Sales Office near you or fill out the Request for Information Form.

Packaging