Amkor Technology offers advanced thermal test measurement capability and state-of-the-art modeling capabilities supporting all
major electronic packaging styles.
| Wind tunnel facility:
Amkor’s closed loop wind tunnel is capable of controlling airflow
from 50 to 1600 LPM and air temperature from 18°C to 65°C.
The tunnel spatial uniformity of velocity is ±1% of the mean
value. The test section is 12x12 inches with a contraction area of
6.5:1. Up to three boards can be tested simultaneously. A data
acquisition and control system provides automated testing over a
preset range of flow rate and power levels. Steady state
convergence tests, based on die level temperature, are used before
stepping to the next power / flow condition. Data are retrieved
automatically and stored in an Access database filing system.
Theta JC and Theta JB Facility:
Cold plate facilities are available for measuring Theta JC and Theta
JB.
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Test Boards:
Amkor maintains a library of JEDEC standard leaded and array
format 1S0P and 1S2P test boards. Custom board design capabilities are also available. |
Thermal Test Reports:
Amkor amassed over 100 thermal test reports covering a wide array of packages
ranging from power application packages such as a PSOP
2 & 3, leaded packages such as LQFP,
exposed pad packages such as MLFs
and array packages such as PBGA. Thermal data includes theta ja over a
range of power levels at flow velocities from 0.0 to 2.5m/s. Psi JT, Psi
JB and Theta JC data are available in many of the thermal reports. |
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Detailed models:
Amkor employs advanced thermal modeling techniques using
finite element analysis (FEA). A CAD-based modeling approach
developed at Amkor has consistently shown a 95% accuracy level
when compared against test data. Individual details such as
traces, vias, solder balls, etc. are explicitly modeled. |
Parametric models:
Turnkey thermal models are also available using Ansys' parametric modeling capabilities. Fewer geometrical details are considered but the models are fully automated. Typical accuracy is 90% or higher. |
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Quick Thermal Calculators:
Quick thermal calculators are available for many package styles.
Immediate thermal resistance estimations are available using a
Web interface.
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Custom Thermal Solutions:
Custom thermal solutions are available at Amkor to optimize component level
designs. This may include laminate or leadframe design optimization, material
property evaluation and board layout analyses. |
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Compact Models:
Compact thermal models are available for predicting die temperature in system level performance. They are developed to provide "boundry condition independent" peak die temperature predictions.
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Computation Fluid Dynamic (CFD):
CFD models are used to more closely predict package performance in custom enviroments. This includes local flow conditions, system packaging and thermal interaction from neighboring components
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