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Test Overview
Test Development
RF Test Services
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Amkor Test Development Overview:

Amkor development centers provide complete engineering services from program development, full product characterization to production ramp. Amkor has an extensive team of senior test engineers with experience in mixed-signal, memory, high-end digital, power management and RF. Reliability and prototype production testing are also supported in these development centers. Amkor also offers expertise in defining test strategies for lowest overall cost and can assist in development of test specifications.

  • Project Management Process(s)
  • Rapid first article development
  • Advanced Wafer Probe
  • Low cost RF probe
  • Hardware ( Contactor, Load board, Probe card, Handler Kits )
  • Robust contacting solutions aligned with Amkor's bump and package roadmap
  • Novel test solution for low cost , bottom PoP ( package-on-package )
  • SiP Module Test Strategies ( including in-line test )
  • Automation of System Level Test solutions
  • Program Conversion
  • Multi Site Test

Amkor Test Development Engineers support a wide variety of ATE platforms:

ATE
MS
RF
Digital
Memory
Verigy 93K  
x
x
x
 
Verigy 83K 
x
     
Teradyne Flex
x
x
x
 
Teradyne Catalyst
x
x
x
 
Teradyne J750
x
 
x
 
LTX CX  
x
x
   
Credence ASL3K , ASL1K
x
x
   
Eagle 364
x
     
NexTest Maverick 
   
x
 
NexTest Magnum 
     
x
RFT
 
x
   
LT / Duo/Quartet
 x
 
 

RF Wafer Test Development

MicroProbe Short Beam Probe Card Technology

  • 3-5 GHz B/W
  • Probe length enables cost effective probe and test many high speed devices

Cascade Membrane Probe Card Technology  

  • 20 GHz B/W
  • 108 I/O Points, Max die size 5.7mm/5.7mm
  • Controlled impedance lines for true KDG testing
  • Lower contact resistance
  • Field replaceable core

GPS Receiver (Max Freq. 1.6GHz)  

  • .18μ JAZZ (SiGe) 1.6v Process
  • Test Performed: Gain, Image Rejection, SNR, Duty Cycle, BP Filter
  • Probecard Technology: MicroProbe Short Beam
  • Tester / Prober: ASL3K / EG4090

DVB-H Tuner (Max Freq. 1680MHz)  

  • Supported Bands (VHF, UHF, L1, L2)
  • Tests Performed: Noise Figure, IP2/IP3, Phase Noise, IQ Mismatch, Small Signal Gain
  • Probecard Technology: MicroProbe Short Beam<
  • Tester / Prober: ASL3K / EG4090

BlueTooth 1.1, 1.2 – RF Transceiver and Modem

  • 0.18μm CMOS, Lead Free Sn / Ag Plated bumps, 90μm diameter
  • Test Performed: Vector Scan Test, Synthesizer Test Tx, Spectral Mask 11-22MHz, Tx Spur, Magnitude Error Tx I/Q Phase Error, Rx Out Gain, Rx Image Rejection Rx I/Q DC Offset, I/Q Phase
  • Probecard Technology: Cascade Membrane
  • Tester / Prober: ASL3K / EG4090

Wafer RF Test Development

RF Test Development

BB SiP Phone Module

  • 15 X 30mm SiP
  • DSP, RF Codec, FBUS, CBUS, SIM, Flash/SDRAM, Energy Management, SIM interface, Audio DAC
  • BIST + ICT for assembly defect testing
  • Tester / Handler: J750 / NS6040

Quad-Band GSM850 / 900 / DCS / PCS PA

  • 6 X 6mm QFN
  • Quad Site Testing
  • Test Performed: 2nd / 3rd Harmonic, Peak2Avg, PAE
  • Tester / Handler: ASL3K / NS6040

Triband GPRS Radio Multi-Chip Module SiP

  • 23 X 15mm SiP
  • Dual Site Test
  • Test Performed: DCS / PCS / GSM 800 / 900 , RSSI, Phase Noise
  • Tester / Handler: ASL3K / NS6040

Test Development

Additional Information:

Description File Type File Size
  Amkor Chandler Test Development Service Sheet
128 kb
  RF Wafer & RF Test Development Service Sheet
140 kb
  RF Test Service Sheet
81 kb
 PSvfBGA Dual Sided Test Contactor Data Sheet
131 kb
 FusionQuad Test Contactor Data Sheet
123 kb

For more information and a presentation on Amkor's Test Development Services, please contact an Amkor Regional Sales Office near you or fill out a Request for Additional Information.


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