Amkor offers full turn-key test solutions as an integral part of our supply chain service. We have the ability to take our customers’ product from prototype to mass production in many different market segments, including computing, wireless, communication, storage, consumer, commercial, industrial, medical, defense and automotive.

Amkor development centers provide complete test engineering services from test program development to full product characterization. Development services are available for a full range of device types such as RF, Mixed Signal, Logic and Memory. Reliability and prototype production testing are also supported in these development centers.

Amkor strives to provide the lowest cost of test through the development of industry leading test and material handling solutions. Amkor offers test development on many of the industry’s popular ATE platforms. In addition, Amkor's proprietary focused RF test system, the RFT, is capable of very efficient testing of RF building block products. Leveraging on Amkor's high density leadframe assembly capability, our pre-singulated strip test process is a highly cost-effective test solution for low pin-count, high volume products.

Amkor supports high volume wafer probe and final test production at our factories in China, Japan, the Philippines, Singapore, South Korea and Taiwan.. World class test engineering resources within the factories provide our customers with the support necessary for maintaining production on a daily basis.

• Full turnkey test development
• Large dedicated test development organization
• Full RF design and test capabilities
• Experience and ability to test a full range of technology including mixed signal, logic and memory
• Engineering support worldwide
• Wide range of test and handling equipment
• Custom test processing - Commercial / Military Flows and Multiple binning & mark after tests

• Broad experience with a number of probe tools installed with 300mm support in most of our Asian factories
• Thermal control capabilities
• Single and two pass probing
• Multi-site probing
• Bake retention
• Bumped wafer probing
• Electronic Assembly  Support:
• Die attach wafer mapping (ALPS)
• Edge dies exclusion
• Wafer map template generation
• Inkless probe
• Probe wafer mapping

Additional Information:

Description	File Type	File Size
Test Service Sheet		121 kb
RF Wafer & RF Test Development Service Sheet		140 kb
RF Test Service Sheet		81 kb
Strip Test Service Sheet		468 kb