| Search Results | 242 Results for services |
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Design Center
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Package design and Co-LayoutDesign Chain ManagementEducational ServicesAutomation SupporteSmart A web-based tool that gives you direct access to Amkor’s design services, eSmart allows you to: Submit design workTrack design workCommunicate effectively with your dedicated designerQuote designs /go/turnkey-services/design-center/design-center |
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Amkor and GEM Services Sign Patent License Agreement
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Amkor and GEM Services Sign Patent License Agreement CHANDLER, Ariz., Aug. 10 -- Amkor Technology, Inc. (Nasdaq: AMKR) and GEM Services Inc. have signed a broad, multi-year patent license agreement that allows GEM to practice under Amkor's portfolio of MicroLeadFrame® patents. According to Terry Davis, Amkor's vice president for MicroLeadFrame® packages, "This agreement recognizes Amkor's substantial, ongoing investments in MLF® technology and intellectual property and its ... /go/press-release/amkor-and-gem-services-sign-patent-license-agreement |
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Amkor Reports Record Fourth Quarter Sales and Return to Profitability
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Amkor's fourth quarter net income was $54 million, or $0.30 per diluted share, compared with net loss of $36 million, or ($0.21) per share, in the fourth quarter of 2004. Amkor's fourth quarter 2005 net income included a gain of $4.4 million on the previously announced sale of Amkor Test Services, a specialty test operation; and severance and separation costs of $3.3 million in connection with corporate realignment activities. (selected operating data and tables to follow) ... /go/press-release/amkor-reports-record-fourth-quarter-sales-and-return-to-profitability |
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Amkor Completes Sale of Wafer Fabrication Services Business for $62 Million
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Amkor Completes Sale of Wafer Fabrication Services Business for $62 Million CHANDLER, AZ, March 3, 2003 - Amkor Technology, Inc. (Nasdaq: AMKR) has completed the sale of its wafer fabrication services business to Korean-based Anam Semiconductor, Inc. (ASI) for a total price of $62 million. Amkor also confirmed that it has obtained releases from key customers of the wafer fabrication business regarding Amkor's contractual obligation to perform wafer... /go/press-release/amkor-completes-sale-of-wafer-fabrication-services-business-for-62-million |
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Turnkey Services
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Getting involved at the die design phase also allows Amkor's Packaging Design Center to create the optimum package for any device. Located worldwide for customer convenience, Amkor offers test services for any device, from simple digital logic, complex ASIC, high speed digital, memory, mixed signal and RF/Wireless devices. These services along with several others such as Die Processing & Inspection, Package Signal Integrity Analysis, Failure Analysis, Qualification Testing... /go/turnkey-services/turnkey-services |
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Amkor to Commence Wafer Bumping in Singapore
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Amkor to Commence Wafer Bumping in Singapore CHANDLER, Ariz.--Feb. 27, 2006--Amkor Technology, Inc. (NASDAQ: AMKR) today announced that it is establishing wafer bumping operations in Singapore using the same processes currently employed by Amkor's Unitive subsidiary in Taiwan. Amkor's Singapore bump facility is expected to commence operations in the second half of 2006 and will provide, in conjunction with Amkor's existing test operations in Singapore, wafer bump and wafer probe services to ... /go/press-release/amkor-to-commence-wafer-bumping-in-singapore |
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Common Platform
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Wafer Probe Test software & probe development Digital, analog, mixed-signal, RF, logic & memory test Integrated EDI yield feedback Dedicated Singapore resources allowing reduced cycle for Common Platform customers. AssemblyTurnkey solutions for wirebond and flip chip Broad portfolio of Pb-free and green packages 39 years of Assembly &... /go/packaging/common-platform/common-platform |
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Die Processing and Die Inspection
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Provides an efficient turnkey solution to supply inspected, packaged die for use in flip chip or chip-on-board applications Avoids the need for the chip supplier to invest in the manufacturing infrastructure for handling and packaging bare die Provides the confidence in working with the leading supplier of semiconductor subcontract assembly and test services with extensive experience in die processing and component packaging Details of ... /go/turnkey-services/die-processing-and-die-inspection/die-processing-and-die-inspection |
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Amkor Enters Into Long-Term Semiconductor Assembly and Test Services Agreement With IBM
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Amkor Enters Into Long-Term Semiconductor Assembly and Test Services Agreement With IBM CHANDLER, Ariz., May 17 - Amkor Technology, Inc. (Nasdaq: AMKR) announced today that it has entered into a strategic long-term agreement with IBM for semiconductor assembly and test services. Four principal elements compose the relationship framework: 1. A long-term supply agreement that Amkor estimates could generate in excess of $1.5 billion in assembly and test revenue through 2010; 2. Amkor will... /go/press-release/amkor-enters-into-long-term-semiconductor-assembly-and-test-services-agreement-with-ibm |
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Quality Policy:"Delighting our customers beyond expectation through continuous improvement withinnovative quality products and services that perform reliably over time" Ten Guiding Quality Principles:1.) The customer is the judge of our Quality. ... /go/about-us/quality-management/quality-management |