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RF Design / Wireless Design Services
Designing RF Subsystems for today’s wireless portable products requires
balancing packaging choices to meet demanding customer targets of cost,
size and performance. Packaging choices range from standard single die
packages to System-in-Package
(SiP). Cost, size and RF performance are strongly influenced by device
technologies, interconnect methodologies, substrate materials and construction,
metallization schemes, embedded and discrete passives, shielding and
encapsulation techniques. Successful RF design requires not only an
understanding of all of these, but also RF system and schematic knowledge,
substrate design and characterization capabilities, and the skills to
present and make engineering tradeoffs. Making the right choices can
make or break the success of your product.
From RF Power Amplifiers to full 802.11 modems, Amkor is committed
to enabling our customers through our interactive RF Design and Applications
Services. We help you optimize the cost, size and performance in your
product choices and provide RF design services to improve your cycle
time. Our RF design engineers know what our customers concerns are and
how to achieve them. After all, our engineers have come from the ranks
of RF and microwave product design organizations ranging from hybrid
modules to handsets.
We can help you achieve your cost, size and performance targets!
Radio
System Intergration
- GSM / DCS / PCS / CDMA
- Bluetooth® / WLAN
- ISM Bands, Zigbee
- GPS, Satellite Radio
- Baseband Sections
RF Packaging
Consultancy
- System level implications to single die package selection
- Advice on Design Rule implications and alternatives
Feasibility Studies for Cost, Size and Performance
Performance
- Examination of multiple options for engineering tradeoffs
RF Co-Design
- System Architecture
- Reference Design Translation
- Substrate Design from System and IC Requirements
- Circuit Design and Characterization
Substrate Defination & Design
Process Definition
Circuit Design & Characterization
- Inductors
- Capacitors (LTCC)
- Couplers
- Loop Filters
- BALUNS
- RF Filters: LPF, HPF, BPF, Notch
- Amplifier Matching Circuitry (RFPA / LNA)
- Antenna / Diversity Switches
- Diplexers
Simulation Tools
- Agilent ADS
- Momentum
- HFSS
Layout Tools
- Cadence APD
- AutoCAD
- Synopsis
Intergration Technologies
- LTCC
- Overmolded Ceramics
- Intergrated Passives
- SD I/O Radio Card
- Antenna Integration
- Shielding
- Passives in MicroLeadFrame®
Protoyping
- Standard Factory Protoyping
- Advanced Process Prototyping
Balun Library
- Customized to your requirements
- Low and High Impedance designs
RF Filter Library for 2.4GHz Products
- Customized to your requirements
- Utilizes 2 Core RF Laminate
- Optimized for WLAN and Bluetooth Applications
- Designs for cellular co-existence
RF component engineering
Bench characterization
Volume characterization
Amkor’s RF co-design services are an affordable alternative to your
precious in-house resources.
Let us be part of your concurrent engineering
team.
Additional
Information:
| Description |
File
Type |
File
Size |
|
RF / Wireless Design Services Sheet |
 |
359 kb
|
RF / Wireless Design Services Sheet
(Japanese Translation) |
|
522 kb
|
|
Design Institute Services Sheet |
|
426 kb |
|
RF Test Services Sheet |
|
181 kb |
IC Packaging Options for Wireless Portable
Applications |
|
324 kb |
|
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