Interconnect Reliability:

Board level reliability is one of most important aspects of package selection. Electronic assemblies experience varied field use stress conditions during their useful life and package-to-board interconnects are required to survive these conditions. As part of our strategy to provide complete packaging solutions to our customers, Amkor offers solder joint reliability characterization of all package styles.

Temperature Cycle Tests:

Amkor employs the following three temperature cycle test conditions for board level reliability, depending on the intended end use application of the package. All of these three conditions comply with IPC-9701 specifications. In-situ electrical testing is performed to identify failures.

Condition (°C)	Min. Temp. (°C)	Max. Temp (Minutes)	Ramp Up Time (Minutes)	Ramp Down Time (Minutes)	High Temp. Dwell (Minutes)	Low Temp. Dwell (Minutes)	Cycle Duration (Minutes)
TC1	-40	125	15 (+5 / -0)	15 (+5 / -0)	15 (+0 / -5)	15 (+0 / -5)	60
TC2	-55	125	2 - 3	2 - 3	12 - 13	12 - 13	30
TC3	0	100	10(+2 / -0)	10 (+2 / -0)	10 (+0 / -2)	10 (+0 / -2)	40

Board Level Drop Tests:

This test is implemented to provide a controlled environment to reproduce the interconnect failure mode commonly experienced during drop loading of handheld electronic systems (e.g., mobile phones, PDAs, etc.). Amkor took the lead in developing a board level drop test standard (JESD22-B111) and all tests are conducted as per this specification.

Cyclic Bend Test:

The cyclic bend test consists of bending the printed circuit board assemblies using a 4-point bend test fixture. This test may be used to reproduce solder joint failures experienced in packages mounted on key pads.

Board Level Solder Joint Reliability Prediction:

In addition to the above test capabilities, Amkor also offers solder joint life prediction capability using finite element simulation. The simulation provides a quick estimation of expected reliability and is used extensively in the pre-design stage. The life prediction approach correctly predicts the location of critical solder joint, location of failure (board or package side) with a high degree of accuracy for actual values.

In addition to temperature cycle condition simulation for Pb / Sn and lead-free solder, Amkor is developing simulation methodologies for bend and drop test simulations..

Additional Information:

Description	File Type	File Size
Electical, Mechanical and Thermal Characterization   Service Sheet		300 kb
Electical, Mechanical and Thermal Characterization   Service Sheet (Japanese Translation)		950 kb