Packages for Wireless Products:

Amkor's broad family of IC packages provides a complete solution for RF and wireless applications. These packages are designed to meet the critical requirements necessary for RF applications, such as excellent electrical performance, very low insertion loss, high isolation among traces, impedance matching and low parasitic parameters. Capacitive, inductive, and resistive parasitic data, as well as S-parameters data up to 20 GHz are available to assist in designing our leadframe and array packages into your RF and wireless applications.

Amkor's SOIC, SSOP, TSSOP, MicroLeadframe^®, ChipArray^® and Flip Chip package designs satisfy the RF wireless receiver and transmitter requirements, such as an enhanced signal-to-noise ratio and impedance matching. The PowerSOP^®, ExposedPad™ TSSOP, and MicroLeadframe^® packages provide improved power efficiency and thermal enhancements that are critical for power amplifier applications. In addition to Amkor's standard packages, custom solutions utilizing leads fused directly to the paddle, heat spreaders, double bonds and other techniques can be implemented to meet your needs.

Amkor's array packages such as the PBGA, SuperBGA^®, ChipArray^®, and MCM-PBGA can be designed to integrate more RF wireless functionality into a single package solution. Amkor's broad family of IC packages These BGA / LGA packages, coupled with Amkor's innovative design and high volume manufacturing capability, address the cost and performance requirements of your high pin count applications. The TapeArray^® BGA is a thin, lightweight, chip scale packages with low parasitic parameters which are also ideal for portable wireless baseband integration. In addition, Amkor offers Flip Chip packages that increase isolation between signals and reduce surface wave leakage and insertion loss by eliminating bond wires.

Amkor's package portfolio also includes solutions suitable for other wireless applications such as DSP, DAC, ADC, MCU, memory, voice / channel coding and decoding, battery/power management, I/O interface, and data communications.

Amkor's high frequency packages are ideal for most RF / Wireless applications such as cordless, pagers, DBS, GPS, Wireless LAN, PDA, Cellular / PCS, & LMDS / MMDS. These packages can be optimized for impedance to enhance performance of different technologies such as GaAs, BiCMOS, Si-Germanium, or CMOS. Amkor delivers a wide range of solutions the RF / Wireless marketplace needs, low cost, high performance, high volume and high reliability products.

Additional Information:

Description	File Type	File Size
RF Test Services Sheet		166 kb
RF / Wireless Design Services Sheet		657 kb
IC Packaging Options for Wireless Portable   Applications		324 kb