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Electrical Application Notes and White Papers
| File |
Description |
Size |
|
White Paper: "Packaging a 40-Gbps Serial Link
Using a Wire-Bonded Plastic Ball Grid Array" |
500 kb
|
|
White Paper: "System-in-Package Technology,
Application and Trends" |
219 kb
|
|
IC Packaging Options for Wireless Portable
Applications |
324 kb
|
|
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