The success of today's high-speed digital and RF circuit designs highly depends on model and measurement accuracy including package characterization. Since the package operates in a complex electrical environment, accurate characterization requires a multi-level approach. Amkor's approach consists of a mix of electrical models based on 2-D / 3-D and Full Wave 3-D package simulations in addition to time and frequency domain measurements. 2-D simulation and measurement based design guidelines are used for pre-layout feasibility and layout design rule generation whereas 3-D lumped, Full Wave 3-D and measurements are reserved for post-layout performance characterization and verification to ensure the design meets electrical specifications.

Electrical Package Co-design and Optimization:

As the data transfer rate, gate counts and circuit density continue to grow, the impact of package electrical performance on overall system performance is growing. Today, delivering an optimum package requires more than just a robust layout and post-layout electrical simulation; it requires close interaction with our customers and substantial engineering support during layout phase. Amkor's Application Engineering and Characterization group closely works with the package designer to make sure the package layout meets all signal integrity performance specifications. You can trust Amkor to select and design the best package for your application and verify package electrical performance through state of the art simulation and measurement tools and techniques.

Amkor's Electrical Characterization Lab offers complete and accurate high frequency package characterization services. Amkor employs real time data acquisition either from a network analyzer or TDR (Time Domain Reflectometry) and uses a variety of high frequency EDA tools such as Agilent-ADS (Advanced Design System) and TDA Systems I-Connect to generate interconnect models based on measurement data.

Modeling and Simulation Tools:

• Ansoft Maxwell Q3D & Q2D
• Ansoft Physical IC modeler (ParICs)
• Ansoft Synopsys Encore interface (AnsoftLinks)
• Ansoft Cadence APD interface (AnsoftLinks)
• Agilent ADS (Advanced Design System)
• Ansoft HFSS (High Frequency Structure Simulator)
• Optimal Corp. PakSi-E High Speed 3D Field Solver
• Agilent Momentum
• Agilent Picosecond Interconnect Modeling
• Synopsis HSpice and Awaves
• Cadence Advance Package Engineer (APE)
• TDA Systems I-Connect
• Sigrity; Power SI and Speed2000

Amkor's Application Engineering and Characterization group addresses the need for higher performance packaging through package co-design, measurement and simulation. To deliver an optimum design, Amkor utilizes measurement based design guidelines that have been developed over the years and extensive post-design modeling and measurements using state-of-the-art tools and techniques for verifications. We recognize that today's fast edges require careful design planning and attention to details. With Amkor's methodology, signal integrity issues such as risetime degradation, crosstalk, I/O bandwidth, power ground noise, time delay and ringing can be predicted before expensive prototypes are built.

Our customers are provided with the following data:

• Inductance (L) and mutual inductance (L_m)
• Capacitance (C) and mutual capacitance (C_m)
• Distributed Lump elements (L, R, C, G)
• Frequency dependent Resistance (R)
• S-parameter data in tabular and graphic format
• Smith charts
• Equivalent transmission line circuits
• Impedance (Z)
• Delay
• Spice decks
• IBIS models
• Power and ground voltage potential

Measurement Equipment:

• Giga-Test Micro Probe Station
• HP-8720D Network Analyzer (50 MHz - 20 GHz)
• HP-4285A Precision LCR Meter
• Tektronix TDS800 Digital Sampling Oscilloscope with 80E04 Differential TDR head

Signal Integrity:

As signal rise times decrease and operating frequencies increase, signal fidelity becomes difficult to control. At Amkor, we have highly integrated signal integrity analysis capabilities to perform board/system level simulation. Packages are characterized with multiple signal integrity runs by varying the rise time, number of power/ground solder balls, number of simultaneously switching signals, etc. This provides our customers with the best-fit package for their customized Integrated Circuits. Signal degradation due to impedance mismatches, crosstalk, and simultaneous switching noise from the package can be evaluated and the package design can be modified to meet performance specifications. Amkor uses highly accurate 2-D/3-D-field solvers and Cadence's Advanced APE for signal integrity analysis. The 3-D-field solver extracts resistance, capacitance and inductance in both lumped and distributed form to achieve the highest accuracy. Cadence's APE is used for delay optimization, crosstalk, reflection, impedance and 2-D parasitic extraction. Since Cadence's APE is tightly integrated with the layout tool, electrical rules can be passed to layout team before and during the design process restricting electrical rule design violations allowing for quicker design turnaround times.

Signal Integrity Capability:

• Interface to most packaging CAD databases and DXF
• Generate propagation delay reports for entire net
• Perform SPICE simulations on individual nets in coupled and un-coupled analysis
• Perform cross talk, reflection, over/under shoot, and timing analysis
• Supply customers with package SPICE models for system level analysis
• Analyze and report skew timing between multiple drivers
• Analyze power ground bounce noise with 3-D extraction

Additional Information:

Description	File Type	File Size
Electical, Mechanical and Thermal Characterization   Service Sheet		300 kb
Electical, Mechanical and Thermal Characterization   Service Sheet (Japanese Translation)		439 kb