Designing RF Subsystems for today’s wireless portable products requires balancing packaging choices to meet demanding customer targets of cost, size and performance. Packaging choices range from standard single die packages to System-in-Package (SiP). Cost, size and RF performance are strongly influenced by device technologies, interconnect methodologies, substrate materials and construction, metallization schemes, embedded and discrete passives, shielding and encapsulation techniques. Successful RF design requires not only an understanding of all of these, but also RF system and schematic knowledge, substrate design and characterization capabilities, and the skills to present and make engineering tradeoffs. Making the right choices can make or break the success of your product.

From RF Power Amplifiers to full 802.11 modems, Amkor is committed to enabling our customers through our interactive RF Design and Applications Services. We help you optimize the cost, size and performance in your product choices and provide RF design services to improve your cycle time. Our RF design engineers know what our customers concerns are and how to achieve them. After all, our engineers have come from the ranks of RF and microwave product design organizations ranging from hybrid modules to handsets.

 We can help you achieve your cost, size and performance targets!

Radio System Intergration

• GSM / DCS / PCS / CDMA
• Bluetooth^® / WLAN
• ISM Bands, Zigbee
• GPS, Satellite Radio
• Baseband Sections

RF Packaging Consultancy

• System level implications to single die package selection
• Advice on Design Rule implications and alternatives

Performance

• Examination of multiple options for engineering tradeoffs

RF Co-Design

• System Architecture
• Reference Design Translation
• Substrate Design from System and IC Requirements
• Circuit Design and Characterization

Substrate Defination & Design

• RF Laminates
• LTCC

Process Definition

• Die Attach
• Wirebond
• Flip Chip
• Die and Package Stacking

Circuit Design & Characterization

• Inductors
• Capacitors (LTCC)
• Couplers
• Loop Filters
• BALUNS
• RF Filters: LPF, HPF, BPF, Notch
• Amplifier Matching Circuitry (RFPA / LNA)
• Antenna / Diversity Switches
• Diplexers

Simulation Tools

• Agilent ADS
• Momentum
• HFSS

Layout Tools

• Cadence APD
• AutoCAD
• Synopsis

Intergration Technologies

• LTCC
• Overmolded Ceramics
• Intergrated Passives
• SD I/O Radio Card
• Antenna Integration
• Shielding
• Passives in MicroLeadFrame^®

Protoyping

• Standard Factory Protoyping
• Advanced Process Prototyping

Balun Library

• Customized to your requirements
• Low and High Impedance designs

RF Filter Library for 2.4GHz Products

• Customized to your requirements
• Utilizes 2 Core RF Laminate
• Optimized for WLAN and Bluetooth Applications
• Designs for cellular co-existence

RF component engineering
Bench characterization
Volume characterization
Feasibility Studies for Cost, Size and Performance

Amkor’s RF co-design services are an affordable alternative to your precious in-house resources.

Let us be part of your concurrent engineering team.

For more information on our RF / Wireless Design services, please contact an Amkor Regional Sales Office near you, your Account Manager or fill out the Request for Additional Information Form.