A world-class design institute providing design, development and knowledge transfer. Four key service areas provide solutions for almost any packaging design need.  Package design and Co-Layout Design Chain Management Educational Services Automation Support

Design Locations

The Institute is comprised of design centers and satellites that are strategically located worldwide. We are located in the USA (Arizona, California and North Carolina), Korea, Taiwan, Philippines, Japan, and China.

A web-based tool that gives you direct access to Amkor’s design services, eSmart allows you to:

• Submit design work
• Track design work
• Communicate effectively with your dedicated designer
• Quote designs

Package Design and Co-Layout

Amkor provides a full range of design services for an incredibly broad selection of packages:

• Quality, error-free designs through utilization of state-of-the-art design software applied in unison with Amkor internally developed design applications
• Customer collaborative Co-Design for electrically sensitive packages
• Complex thermal and mechanical FMEA analysis with results used to perfect packages for first-pass design excellence
• Concurrent and post-design characterization. Refer to Electrical Package Characterization and Thermal Package Characterization for offerings

Design Chain Management

Amkor provides a range of Design Chain Management services including:

• Design Chain Definition and Integration
• Design Chain Analysis & Optimization
• Metric Definition and Tracking
• Process Integration and Improvement

Process Integration Services

Focused on improving your internal packaging design process, our Process Integration experts are available to document your current process and suggest specific time and money saving strategies. Further, we provide assistance in implementing these changes. We can also integrate your current process with the Amkor Design Institute’s mature packaging methodologies. From Design rules to post design characterization, our process may be seamlessly integrated with your current process, reducing time-to-market and errors. 

Educational Services

Amkor offers a variety of educational services to provide customers with the skills required to design complex packages. Offerings include package specific design training; design for manufacturability and design for cost. We can customize our Educational services to meet your needs and roadmaps.

Customer Design Rules

Amkor customers have access to Customer Approved Design Rules through web.Data. These rules are updated periodically and email notifications are automatically sent to the customer advising them that the new rules are available.

Automation Support

Today’s packaging organizations are often left without automation support. Amkor can provide a full range of automation and EDA support services; include everything from package library management to a robust catalog of automation tools. eSmart is the backbone of our infrastructure.

DQS (Design Quick Start) is an example of Amkor's powerful automation capability. DQS allows up-to-date access to Amkor's design libraries and automatically builds a Cadence Allegro / APD or Synopsys ICP database with all of the parts required for a successful Amkor design. With Design Quick Start, the designer can have all of the components, pad stacks, and strip data loaded into the design, making the design immediately ready for laying out bond fingers and routing.

Doc Pro is Amkor's AutoCAD based drawing documentation tool. Doc Pro is linked to Amkor's design tracking system and automatically populates the required fields with verified design values based on request and package type. Doc Pro has dramatically decreased the time required to document a design and has virtually eliminated all manual drawing input.

CAD / CAM Tool Automation is a family of highly specialized tools that have been developed by Amkor to aid cycle time reduction and increase accuracy of advanced package designs. Examples below include: Flag and Ring Utilities, Same-Net, Via-Checking, and Via Dogbone Utility.

3-D Wire Bond Checker is Amkor's wire bond verification tool, which received the coveted Advanced Packaging Award in the Package Design Software and Equipment Category. This proprietary tool provides true 3-D spacing checks, including items such as capillary interference, z-axis wire spacing, and design wire profiles/tiers (including auto assignment). It considers manufacturing values such as capillary cross section, wire profile, die thickness, spacer dimensions, die attach dimensions, and even bonding sequence (wire bond machine methodology). The 3-D Wire Bond Checker brings factory knowledge to the fingertips of both the designer and the customer. This helps to verify and improve designs during the initial design phases, leading to shortened design cycles and improved yields.

Additional Information:

Description	File Type	File Size
Design Institute Services Sheet		994 kb
RF / Wireless Design Services Sheet		359 kb
"QuickLogic Announces Design Services Agreement with Amkor", QuickLogic Press Release September 12, 2005
"Special Delivery: How Amkor's packaging proficiency helped Cisco's switches." Article from Electronics DesignChain Magazine, Fall 2004 Volume 3		170 kb

For more information and a presentation on Amkor's Design Center Institute, please contact an Amkor Regional Sales Office near you, contact your Account Manager or fill out a Request for Additional Information.