The industry's transition to 300 mm wafer technology is in full swing. Amkor has established capability to support the unique and challenging needs of handling and processing of 12 inch wafers. Chip manufacturers demand the highest levels of sophistication in the tools used for wafer handling, transport and storage. Amkor now has fully qualified production assembly capability for flip chip, WLCSP and wire bond products in place for handling 300 mm wafers in several of our factories worldwide. Future expansion of 300 mm capability will be made as necessary to meet the growing demands of the market.

Amkor offers high volume electroplated wafer solder bumping for 300 mm wafers, including Low Alpha, High Lead, Eutectic, and Lead Free in our Taiwan and Singapore facilities. Amkor has rapidly expanded our 300 mm bumping production capacity to meet the growing “Turn-Key” Flip Chip business model which includes bumped wafer probe, assembly, and test.

Amkor also now offers one of the world’s first turnkey services for high volume 300mm WLCSP production. These services facilitate the entire process from unbumped wafers to the shipment of tested die in tape and reel.

300 mm Qualified Tooling:

• Wafer bump
• Wafer shipper - Unpacker / packer
• Wafer mount to dicing frame
• Wafer sawing
• Wafer map capability
• Wafer Probe
• Backside grind
• Backside grind taper
• Backside grind detaper
• Inspection scopes
• Measurement tools
• Automated defect inspection
• Die attach
• Flip chip attach
• Laser Mark
• Tape and Reel

Specific 300 mm handling capabilities may vary by factory location.

Additional Information:

Description	File Type	File Size
300 mm Wafer Process Services Sheet		209 kb
300 mm Wafer Process Services Sheet   (Japanese Translation)		321 kb
Wafer Bumping Processes and Die Level   Interconnect Technology Services Sheet		131 kb
CSPnl™ Wafer Level Packaging Data Sheet		161 kb

For more information on Amkor's 300 mm Wafer Process Services, please contact an Amkor Regional Sales Office near you, contact your Account Manager or fill out a Request for Additional Information.