We also offer other package types such as: BCC, BQFP, BOC, CCD II, CCD III, DIC, DIP, DLP, ezBGA, FQFP, Flip Stack, HYBRID, J-Lead, LCPGA, LDCC, LLCC, LTCC, M2BGA, M2CSP, MCSP, MDIP, Memory CSP, Micro EMS, PLGA, PQFP, QFJ, SMD Modules, SOP, SZIP, TAPP™, TBGA, ViperBGA, VBGA, Wafer Backgrind, Wafer Saw, ZIP.
For additional information on the above packages, please email: marketing@amkor.com or fill out Request for Additional Information Form.
TAPP™ is a trademark of ASAT Holdings Ltd. |
