 Customer demand for highly sophisticated and ever smaller devices has made semiconductor packaging a vital contributor to system performance. As integrated circuits have become faster and more complex, the cost and performance of the interconnect between chip and system board has become both a significant challenge and an enabling technology.
- Providing the required number of I/Os in the smallest possible footprint
- Matching electrical characteristics between chip and system board
- Enabling a reliable / economical connection on every pad
- Delivering functional system integration through System in Package (SiP) solutions
- Providing test, design and reliability services
Advances in packaging are being driven by semiconductor technology and the explosion in the wireless and internet markets. Amkor is an industry leader in finding packaging solutions to meet these complex requirements.
To serve the diverse needs of more than 200+ world class semiconductor
manufacturers, Amkor offers more than 850+ different package formats and
sizes, from traditional leadframe packages for through-hole and surface
mounting, all the way to the latest chip scale and ball grid array solutions
required in high pin count and high density applications. This broad product
family allows Amkor to be a single source for many of its customers' total
IC packaging requirements from legacy devices to tomorrow's System in Package
solutions.
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