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Thin Small Outline Package (TSOP)
 Amkor offers a full family of popular TSOP 1 packages to serve the needs of IC designers, PCB / system engineers
and component specifiers. Small and thin, these 1.0 mm body packages were designed and introduced to
operate reliably in a variety of environments. Particular attention was focused on
material sets and assembly processes to address user issues such as flatness,
coplanarity, wire sweep, delamination, solderability and more.
Applications:
The prime application for this technology is memory. SRAM, FLASH, FSRAM
and E2 PROM find this package symbiotic with end-use products. Amkor answers
the needs required by pagers, telecom / cellular, memory modules, PC (PCMCIA) cards, wireless and other
countless product applications. These products demand more of IC packages and Amkor delivers.
Features:
Amkor’s TSOP packages offer:
- 28 to 56 lead counts for TSOP 1
- 40 to 86 lead counts for TSOP 2
- 8 x 13.4 mm to 14 x 20 mm package sizes
for TSOP 1
- 10.16 mm package size for TSOP 1
- Hi-conductivity copper leadframes
- JEDEC standard compliance
- Low stress die attach adhesive
- Precisely controlled wire loop height
- Enhanced design for memory applications
Thermal Resistance:
Forced Convection, Single-Layer PCB, JEDEC Standard Test Boards
| |
|
|
Theta JA (°C/W) by Velocity |
| Pkg |
Body Size (mm) |
0 |
200 |
500 |
| 32 ld |
8 x 14 |
85.2 |
66.6 |
58.5 |
| 40 ld |
10 x 20 |
75.0 |
57.2 |
48.6 |
| 48 ld |
12 x 20 |
80.1 |
62.4 |
54.2 |
Forced Convection, Multi-Layer PCB, JEDEC Standard Test Boards
| |
|
|
Theta JA (°C/W) by Velocity |
| Pkg |
Body Size (mm) |
0 |
200 |
500 |
| 32 ld |
8 x 14 |
53.2 |
46.4 |
43.0 |
| 40 ld |
10 x 20 |
44.6 |
37.6 |
34.2 |
| 48 ld |
12 x 20 |
50.8 |
43.7 |
40.0 |
Reliability:
TSOP 1 packages are tested to assure reliable, long term operation for your die.
| PCT: |
121°C, 15 PSI, 168 hours |
| Temp cycle: |
-65/+150 °C, 1000 cycles |
| Temp / Humidity: |
85°C/85% RH, 1000 hours |
| High temp storage: |
150°C, 1000 hours |
Process Highlights:
| Die Thickness (max): |
11-12 mil |
| Strip Solder plating: |
85/15 Sn/Pb |
| Strip Marking: |
Laser/pad |
| Lead inspection: |
Optical |
| Pack/ship options: |
Bar code/dry pack/TNR |
| Bond pad pitch: |
0.13 mm |
| Wafer backgrinding: |
Available |
| Coplanarity (max): |
0.08 mm |
Test Services:
Contact Amkor Test Services for more details.
- Program generation/conversion
- Product engineering support
- Wafer sort
- Ambient to +165 °C test available
- Tape and reel services
- Burn-in
Shipping:
- JEDEC outline CS-020 low profile tray
Additional Information:
| Description |
File Type |
File Size |
| TSOP 1 Data Sheet |
 |
442 kb |
For more information on the TSOP package, please contact an Amkor Regional Sales Office near you, your Account Manager or fill out the Request for Additional Information Form.
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